573300D00000G in Box by Boyd | Heatsinks | Future Electronics
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Boyd | 573300D00000G

Manufacturer Part #

573300D00000G

TO-263 Surface Mount 18.00 C/W Thermal Resistance D2 Semiconductor Heat Sink

ECAD Model:
Mfr. Name: Boyd
Standard Pkg:
Product Variant Information section
Date Code:
Product Specification Section
Boyd 573300D00000G - Technical Attributes
Attributes Table
Thermal Resistance: 18°C/W
Material: Matte Tin Plated
Dimension: H  10.16mm x L  26.16mm x W  12.7mm
Features & Applications
The 573300D00000G is a Surface mount heat sink for D2 Pak (TO-263) package semiconductors.

This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.

Specifications:

  • Shape: Rectangular
  • Length: 0.500" (12.70 mm)
  • Width: 1.030" (26.16 mm)
  • Height of Fin: 0.400" (10.16 mm) 
  • Power Dissipation @ Temperature Rise: 1.25 W @ 30°C
  • Thermal Resistance @ Forced Air Flow: 8°C/W @ 300 LFM
  • Thermal Resistance @ Natural: 18°C/W
  • Package: TO-263 (D2Pak)??
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Pricing Section
Global Stock:
0
USA:
0
On Order:Order inventroy details
4,802
Factory Stock:Factory Stock:
0
Factory Lead Time:
6 Weeks
Minimum Order:
1
Multiple Of:
1
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Tariff charges may apply if shipping to the United States. An estimate of tariff charges will be calculated at checkout.
Total
$1.12
USD
Quantity
Unit Price
1
$1.12
25
$1.09
75
$1.06
150
$1.04
400+
$0.985
Product Variant Information section
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