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Manufacturer Part #
MCP9509CT-E/OT
Download the CAD models for this product. Learn more about SnapMagic.
3000 per Reel
SOT-23-5 (SOT-25)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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ECCN:
PCN Information:
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
***UPDATE OF PCN113107***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP4014, MCP4024, MCP6421, MCP6471, MCP6481, MCP6491, MCP6V11xx, MCP6V16xx, MCP6V31xx, MCP6V36xx, MCP6V61xx, MCP6V66xx, MCP6V71xx, MCP6V76xx, MCP6V81xx, MCP6V86xx, MCP6V91xx, MCP6V96xx, MCP73811, MCP73812, MCP73831, MCP73832, MCP9501, MCP9502, MCP9503, MCP9504, MCP9509, MCP9800, MCP9802 and MIC333 device families in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new bond wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)Revision History: May 16, 2025: Issued final notification.May 22, 2025: Re-issued final notification to update the Qualification Report.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP4014, MCP4024, MCP6421, MCP6471, MCP6481, MCP6491, MCP6V11xx, MCP6V16xx, MCP6V31xx, MCP6V36xx, MCP6V61xx, MCP6V66xx, MCP6V71xx, MCP6V76xx, MCP6V81xx, MCP6V86xx, MCP6V91xx, MCP6V96xx, MCP73811, MCP73812, MCP73831, MCP73832, MCP9501, MCP9502, MCP9503, MCP9504, MCP9509, MCP9800, MCP9802 and MIC333 device families in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new bond wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
The MCP9509 series devices are programmable logic output temperature switches. The temperature switch threshold can be programmed with a single external resistor, which provides high design flexibility and simplicity. In addition, this family of devices provide user programmable features such as 2°C and 10°C (typical) switch hysteresis and output structure configuration.
The MCP9509 provides an open drain output, whereas the MCP9510 is offered in three different user selectable output configurations: Active-low/Active-high push pull and Active-Low Open-Drain output with an internal 100 kΩ pull-up resistor.
Features:
Applications:
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