Manufacturer Part #
DSPIC33FJ06GS102A-I/SO
dsPIC33F Series 256 B RAM 6 kB Flash 16-Bit Digital Signal Controller - SOIC-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:27 per Tube Package Style:SOIC-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip DSPIC33FJ06GS102A-I/SO - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
Microchip DSPIC33FJ06GS102A-I/SO - Technical Attributes
| Family Name: | dsPIC33F |
| Core Processor: | dsPIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 6kB |
| RAM Size: | 256B |
| Speed: | 40MHz |
| No of I/O Lines: | 21 |
| InterfaceType / Connectivity: | IrDA/I2C/LIN/SPI/UART |
| Peripherals: | POR/PWM/Watchdog |
| Number Of Timers: | 2 |
| Supply Voltage: | 3V to 3.6V |
| On-Chip ADC: | 6-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SOIC-28 |
| Mounting Method: | Surface Mount |
Features & Applications
The DSPIC33FJ06GS102A-I/SO is a 256 B RAM 6 kB flash SMPS & Digital Power Conversion 16-bit Digital Signal Controller. It offer features supporting common, multi-loop digital switch-mode power supplies (SMPS) and other digital power-conversion applications.
Features:
- CPU:
- Up to 40 MIPS Operation (at 3.0-3.6V)
- 16 x 16 Fractional/Integer Hardware Multiply, Single Cycle Execution
- Single-Cycle Multiply and Accumulate
- 32-bit by 16-bit Hardware Divider
- C Compiler Optimized Instruction Set
- System:
- Internal oscillator and Phase-Locked Loop (PLL) with 120 MHz VCO
- On-chip LDO Voltage Regulator
- JTAG Boundary Scan and Flash Memory Program Support
- Fail-Safe Clock Monitor – allows safe shutdown if clock fails
- Watchdog Timer with separate RC oscillator
- High-Speed PWM Module Features:
- Two pairs of PWM outputs
- Dead Time for Rising and Falling Edges
- Duty Cycle Resolution of 1.04 ns for Dead-Time, Phase Shift, and Frequency
- Supported PWM modes: Standard Edge-Aligned, True Independent Output, Complementary, Center-Aligned, Push-Pull, Multi-Phase, Variable Phase, Fixed Off-Time, Current Reset, and Current-Limit
- PWMxL, PWMxH Output Pin Swapping
- PWM4H, PWM4L Pins Remappable
- On-the-Fly PWM Frequency, Duty Cycle and Phase Shift Changes
- High-Speed Analog Comparator:
- Two Analog Comparators
- 10-bit DAC for each analog comparator
- High-Speed ADC:
- 10-Bit Resolution
- 6 Input Channels
- 2 Msps Conversion rate
- Independent Trigger Source Section for each Analog Input Conversion Pair
- Peripherals:
- UART Module with LIN and IrDA® support
- SPI Module with FIFO
- I2C™ Module with Master and Slave Modes
- 2 16-bit Timer Modules
Applications:
- AC to DC Converters
- DC to DC Converters
- Power Factor Correction (PFC)
- Uninterruptible power supply (UPS)
- Inverters
- Embedded Power-Supply Controllers
- Circuit Breakers, Arc Fault Detection
- Digital Lighting
Available Packaging
Package Qty:
27 per Tube
Package Style:
SOIC-28
Mounting Method:
Surface Mount