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Manufacturer Part #
AT28C64B-15JU
AT28C64B Series 64 Kb (8 K x 8) 5.5 V Surface Mount Parallel EEPROM - PLCC-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:32 per Tube Package Style:PLCC-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2403 | ||||||||||
Microchip AT28C64B-15JU - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 112961 ***Description of Change: Qualification of MMT as new final test site for selected AT27C040, AT27C080, AT27LV040A, AT28HC256, AT28HC256E, AT28C256, AT28BV256, AT28C256EF, AT27C010, AT28HC64BF, AT28BV64B, AT27BV256, AT27LV256A, AT28HC64B, AT27BV010, AT28C64B, AT27C256R, AT27LV010A, AT27LV020A, AT27C512R, AT27C020 and AT27LV512A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change: To improve manufacturability by qualifying MMT as a new final test site.Estimated First Ship Date: 12 October 2025 (date code: 2541)Revision History:April 30, 2025: Issued initial notification.September 18, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 12, 2025.
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of MMT as new final test site for selected AT27C040, AT27C080, AT27LV040A, AT28HC256, AT28HC256E, AT28C256, AT28BV256, AT28C256EF, AT27C010, AT28HC64BF, AT28BV64B, AT27BV256, AT27LV256A, AT28HC64B, AT27BV010, AT28C64B, AT27C256R, AT27LV010A, AT27LV020A, AT27C512R, AT27C020 and AT27LV512A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change: To improve manufacturability by qualifying MMT as a new final test site.Estimated Qualification Completion Date: June 2025
Microchip has released a new Datasheet for the AT28C64B - 64-Kbit (8K x 8) Industrial Parallel EEPROM with Page Write and Software Data Protection of devices.Notification Status: FinalDescription of Change: Removed 28-Lead TSOP package. Updated 32-Lead PLCC package drawing to latest revision (no change to form, fit or function).Impacts to Data Sheet: NoneReason for change: To correct / revise datasheet.Change Implementation Status: CompleteDate Document Changes Effective: 07 Aug 2023
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT28C64B-15JU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/6042735
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT28C64B-15JU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/6042735
Microchip AT28C64B-15JU - Technical Attributes
| Memory Density: | 64kb |
| Memory Organization: | 8 K x 8 |
| Supply Voltage-Nom: | 4.5V to 5.5V |
| Write Cycle Time-Max (tWC): | 10ms |
| Access Time-Max: | 150ns |
| Package Style: | PLCC-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
32 per Tube
Package Style:
PLCC-32
Mounting Method:
Surface Mount