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Manufacturer Part #
MCP98243T-BE/MNYAA
MCP9843 Series 5.5 V - 40 C to + 125 C Memory Module Temperature Sensor - TDFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:11000 per Reel Package Style:TDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP98243T-BE/MNYAA - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:December 21, 2020: Issued initial notification.April 7, 2021: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on April 15, 2021.April 13, 2021: Re-issued final notification. Corrected the lead frame lead-lock from Yes to No.Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date:April 15, 2021 (date code: 2116)
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site. Estimated First Ship Date:April 15, 2021 (date code: 2116)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
Microchip MCP98243T-BE/MNYAA - Technical Attributes
| Output Type: | Digital |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temp Range: | -40°C to +125°C |
| Output Current-Max: | 200µA |
| Package Style: | TDFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
11000 per Reel
Package Style:
TDFN-8
Mounting Method:
Surface Mount