

Manufacturer Part #
ATSENSE101A-SU
Product Specification Section
Microchip ATSENSE101A-SU - Product Specification
Shipping Information:
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Item cannot ship to following countries:
ECCN:
Not yet classified.
PCN Information:
File
Date
Die Coat Change
10/12/2021 Details and Download
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Implementation of Die Overcoat material with Polyimide layer for ATSENSEx01, ATSAM4CMxxx and ATSAM4CMx32 device families available in 20L SOIC, 32L TQFP and 100L LQFP packages.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve manufacturability by implementing of Die Overcoat material (Polyimide layer). Die overcoat protect the die against scratches, package stress and increase mold compound adhesion during assembly process.Change Implementation Status: In ProgressEstimated First Ship Date: October 28,2021 (date code: 2144)
Part Status:
Active
Active
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Quantity
Unit Price
222+
$3.19
Product Variant Information section
Available Packaging
Package Qty:
37 per Std. Mfr. Pkg