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Manufacturer Part #
MCP3426A2-E/MC
Microchip MCP3426A2-E/MC - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of MMT as an additional assembly site for selected products available 8L DFN(3x3x0.9mm and 2x3x0.9mm) packages.Pre Change:Assembled at NSEB using gold (Au) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach material, EFTEC-64T lead frame or C194 lead frame material, Ag DAP surface prep or Bare Cu DAP surface prep and without lead lock lead framePost Change:Assembled at NSEB using gold (Au) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach material, EFTEC-64T lead frame or C194 lead frame material, Ag DAP surface prep or Bare Cu DAP surface prep and without lead lock lead frame or Assembled at MMT using palladium coated copper with gold flash (CuPdAu) bond wire, 3280 die attach material, C194 lead frame material, Bare Cu DAP surface prep and with lead lock lead frame.Pre and Post Change Summary: see attachedImpacts to Data Sheet: None Change Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date February 10, 2021 (date code: 2108)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary : see attachedRevision History:January 27, 2021: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on February 10, 2021.The change described in this PCN does not alter Microchip?s current regulatory compliance regarding the material content of the applicable products.
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
CCB 1474 Initial Notice: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Description of Change: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Pre Change: EFTEC-64T lead-framePost Change: EFTEC-64T or C194 lead-frameReason for Change: To improve on-time delivery performance by qualifying an additional lead frame materialNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Available Packaging
Package Qty:
150 per Std. Mfr. Pkg