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Manufacturer Part #
34AA02-E/SN
Microchip 34AA02-E/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Datasheet for the 34AA02/34LC02-2-Kbit I2C Serial EEPROM Software Write-Protect of devices. Notification Status: FinalDescription of Change:Fixed the SOT-23 pinout descriptions on page 1 and in Product Identification System section.Pinout was in error and packages listed showed 5-pin that should be 6-pin.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 15 Jun 2023
Microchip has released a new Product Documents for the 34AA02/34LC02 2K I2C Serial EEPROM Software Write-Protect Data Sheet of devices. If you are using one of these devices please read the document located at 34AA02/34LC02 2K I2C Serial EEPROM Software Write-Protect Data Sheet.Description of Change: 1) Added Automotive Product Identification System section 2) Fixed TBUF typo and added 1 MHz spec 3) Updated MSOP, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings 4) Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively 5) Reformatted some sections for better readability.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 13 Apr 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Available Packaging
Package Qty:
100 per Std. Mfr. Pkg