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Manufacturer Part #
TC74A4-5.0VCTTR
Product Specification Section
Microchip TC74A4-5.0VCTTR - Product Specification
Shipping Information:
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ECCN:
Not yet classified.
PCN Information:
File
Date
Wire Bond Method/Material Change
09/30/2022 Details and Download
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx, TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Active
Active
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Quantity
Unit Price
3,000+
$0.903
Product Variant Information section
Available Packaging
Package Qty:
3000 per Std. Mfr. Pkg