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Manufacturer Part #
ATSAMD21J17D-MF
Microchip ATSAMD21J17D-MF - Product Specification
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Notification Status: FinalDescription of Change:The following errata were added:? SERCOM: 1.15.15 USART in Auto-Baud Mode? TC: 1.17.3 DMA TriggerImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 07 Oct 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Microchip has released a new Product Documents for the SAM D21/DA1 Family Data Sheet of devices.Notification Status: FinalDescription of Change: SYSCTRL- Removed erroneous text from the DFLLRDY bitfield of the PCLKSR Register.DMAC- Removed non-applicable text from Burst Transfer in DMA. TCC- Updated the number of TCC Instances in Overview.ADC- Updated the Equations in Prescaler for Single-Shot and Free-Running Modes.AC- Added a new paragraph to Overview for L-Variant devices.DAC- Updated Synchronization to reflect that no bits need synchronization.Electrical Characteristics at 85?C? Updated the POR Operating Principle figure to properly reflect an Internal RESET in Power-On-Reset (POR) Characteristics? Updated the following figures in BOD33 to properly display the Internal RESET: ? BOD33 Hysteresis OFF ? BOD33 Hysteresis ON ? Removed erroneous SS line from the SPI Timing Requirements in Host Mode figure in SERCOM in SPI Mode Timing SAM DA1 Electrical Characteristics at 105?C- Updated the values in the BOD33 LEVEL Value table in BOD33. Appendix B- Updated Ordering Information with a new table reflecting all ISELED parts. Packaging Information- Updated the following packages with a new note: ? 64-Pin VQFN ? 48-Pin VQFN - Added the following package: ? 64-Lead VQFN 4Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 10 Sept 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the SAM D21 / DA1 Family Silicon Errata and Data Sheet Clarification of devicesNotification Status: FinalDescription of Change: The following updates were performed in this revision:? Added new notes to the SAM D21 Family Silicon Device Identification table? Added a new Data Sheet Clarification for BOD33? Added the following silicon errata issue:? BOD33: 1.21.1 HysteresisImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 Aug 2021
Microchip has released a new Product Documents for the SAM D21 / DA1 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change:The following Data Sheet Clarifications were added in this revision:? 2.1 Voltage Reference Names? 2.2 DAC Accuracy Characteristics - conversion rate? 2.3 Decoupling Requirements? 2.4 Moisture Sensitivity LevelThe following Silicon errata were added in this revision:? ADC: 1.4.2 Offset Correction? DEVICE: 1.5.7 Standby Entry? DEVICE: 1.5.8 Standby Wake-upReason for Change: To Improve Productivity
Description of Change: This revision includes the updates as listed below and numerous typographical corrections throughout the document.Updated the following sections:? General? Features? Ordering Information? Pinout? I/O Multiplexing? Product Mapping? Memories? Processor and Architecture? DSU? Clock System? GCLK? SYSCTRL? RTC? DMAC? EIC? NVMCTRL? EVSYS? SERCOM I2C? I2S? TC? USB? ADC? DAC? Electrical Characteristics at 85?C? Electrical Characteristics at 105?C? Electrical Characteristics at 125?C? AEC-Q100 125?C Specifications? SAM DA1 Electrical Characteristics? Appendix B? PackagingReason for Change: To Improve Productivity
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Available Packaging
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260 per Std. Mfr. Pkg