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Manufacturer Part #
SS14HE3-LTP
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| Mfr. Name: | Micro Commercial Components | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Std. Mfr. Pkg | ||||||||||
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Micro Commercial Components SS14HE3-LTP - Product Specification
Shipping Information:
ECCN:
PCN Information:
Change description:1.Plating process change: Production transfer to high-speed plating line(Rack Plating), to improve production efficiency. (Please refer to table 1 in Appendix 1)2. Molding equipment change: Changing from semi-automatic molding equipment to automatic molding equipment improves productproduction efficiency and quality. (Please refer to table 2 inAppendix 1)Reason for change:1. Improve equipment automation capabilities, Improve productproduction efficiency and quality.2. Optimize pin forming shape, reduce mechanical stress duringforming, and improve product quality.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SS14HE3-LTP&field4=Micro Commercial Components&field18=https://p1na.futureelectronics.com/p/C514011303
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SS14HE3-LTP&field4=Micro Commercial Components&field18=https://p1na.futureelectronics.com/p/C514011303
Available Packaging
Package Qty:
5000 per Std. Mfr. Pkg