
Manufacturer Part #
MCP6021T-E/OT
MCP6021 Series 5.5 V 10 MHz Rail-to-Rail I/O Operational Amplifier- SOT-23-5
Microchip MCP6021T-E/OT - Product Specification
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx,TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Datasheet for the MCP6021/1R/2/3/4 - Rail-to-Rail Input/Output, 10 MHz Op Amps of devices. Notification Status: FinalDescription of Change: ? Added Section ?Product Identification System (Automotive)?.? Updated 6.0 ?Packaging Information?Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Apr 2023
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx, TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
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Microchip MCP6021T-E/OT - Technical Attributes
Amplifier Type: | General Purpose |
No of Channels: | 1 |
Slew Rate-Nom: | 7V/ns |
Input Offset Voltage-Max: | 500µV |
Gain Bandwidth Product: | 10MHz |
Average Bias Current-Max: | 5000pA |
Supply Voltage: | 2.5V to 5.5V |
Common Mode Rejection Ratio: | 90dB |
Supply Current: | 1mA |
Output Type: | Rail to Rail |
Power Supply Rejection Ratio: | 90dB |
Operating Temp Range: | -40°C to +125°C |
DC Voltage Gain: | 110dB |
Phase Margin: | 65° |
Low Noise: | 8.7nV/√Hz |
Output Current: | 30mA |
Package Style: | SOT-23-5 (SOT-25) |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount