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Manufacturer Part #
MCP6293-E/SN
MCP6293 Series 6 V 10 MHz Rail-to-Rail I/O Operational Amplifier - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount |
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Microchip MCP6293-E/SN - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: Linear Comparators, Linear Op AmpsDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected MCP601, MCP603, MCP6041, MCP6043, MCP606, MCP608, MCP6141, MCP6143, MCP616, MCP6231, MCP6241, MCP6271, MCP6273, MCP6281, MCP6283, MCP6291, MCP6293, MCP6541, MCP6546, MCP6L1 and MCP6L71 device families available in 8L SOIC (.150in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: March 2026
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
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Microchip MCP6293-E/SN - Technical Attributes
| Amplifier Type: | General Purpose |
| No of Channels: | 1 |
| Slew Rate-Nom: | 7V/µs |
| Input Offset Voltage-Max: | 3mV |
| Gain Bandwidth Product: | 10MHz |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 2.4V to 6V |
| Common Mode Rejection Ratio: | 85dB |
| Supply Current: | 1mA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 90dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 110dB |
| Phase Margin: | 65° |
| Low Noise: | 8.7nV/√Hz |
| Output Current: | 25mA |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6293-E/SN is a part of MCP6293 Series Operational Amplifier. It can sustain a standard temperature ranging from -40 to 125°C. It comes in 8 pin SOIC package.
Features:
- Gain Bandwidth Product: 10 MHz (typical)
- Supply Current: IQ = 1 mA (typical)
- Supply Voltage: 2.4 V to 6.0 V
- Rail-to-Rail Input/Output
- Extended Temperature Range: –40°C to +125°C
- Available in Single, Dual and Quad Packages
- Single (MCP6293)
- Dual (MCP6295)
Application:
- Automotive
- Portable Equipment
- Photodiode Amplifier
- Analog Filters
- Notebooks and PDAs
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount