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Manufacturer Part #
MIC5201-3.0YM
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95 per Tube
SOIC-8
Surface Mount
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COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for selected MIC2012, MIC2025, MIC2026, MIC2042, MIC2043, MIC2075, MIC2076, MIC2172, MIC2536, MIC2544, MIC2544A, MIC2545A, MIC2548, MIC2548A, MIC2549A, MIC2582, MIC2587, MIC29201, MIC29204, MIC2951, MIC2954, MIC3172, MIC3203, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC38HC42, MIC38HC43, MIC38HC44, MIC38HC45, MIC4223, MIC4224, MIC4225, MIC4801, MIC5014, MIC5015, MIC5020, MIC5021, MIC5156, MIC5200, MIC5201 and MIC5202 device families available in 8L SOIC (.150in) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC5200, MIC5201 and MIC5202 device families of 20K (BCDM) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiriesEstimated First Ship Date: 23 February 2026 (date code: 2609)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: September 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
The MIC5201-3.0YM is an efficient linear voltage regulator with very low dropout voltage (typically 17 mV at light loads and 200 mV at 100 mA), and very low ground current (1 mA at 100 mA output), offering better than 1% initial accuracy with a logic compatible on-off switching input.
The MIC5201 is designed especially for hand-held battery powered devices, it can be switched by a CMOS or TTL compatible enable signal. This enable control may be connected directly to VIN if unneeded. When disabled, power consumption drops nearly to zero. The ground current of the MIC5201 increases only slightly in dropout, further prolonging battery life. Key MIC5201 features include current limiting, overtemperature shutdown, and protection against reversed battery. The MIC5201 is available in several fixed voltages and accuracy configurations. It features the same pinout as the LT1121 with better performance. Other options are available; contact Micrel for details.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.