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Manufacturer Part #
MIC5310-OGYML-TR
MIC5310 Series 5.5 V 150 mA Surface Mount Dual µCap LDO - MLF-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:5000 per Reel Package Style:MLF-8 Mounting Method:Surface Mount |
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Microchip MIC5310-OGYML-TR - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
***UPDATE OF PCN112600 & PCN112910***Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.Estimated First Ship Date: 18 July 2025 (date code: 2529)Revision History: April 29, 2025: Issued initial notification.May 14, 2025: Re-issued initial notification to update the dimensions of the T/R antistatic shield bag of UNIG from inches to mm for both length and width and mils to mm for thickness.July 02, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on July 18, 2025.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
******FPCN112600 UPDATE******Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8LVDFN(2x2x0.9mm).***Re-issued initial notification to update the dimensions of the T/R antistatic shield bag of UNIG from inches to mm for both length and width and mils to mm for thickness***Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Part Status:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC5310-OGYML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/analog--regulators-reference--linear-regulators/mic5310-ogyml-tr-microchip-2016373
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC5310-OGYML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/analog--regulators-reference--linear-regulators/mic5310-ogyml-tr-microchip-2016373
Microchip MIC5310-OGYML-TR - Technical Attributes
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 5.5V |
| Output Voltage Fixed: | 2.9V/1.8V |
| Dropout Voltage-Max: | 100mV |
| Output Current-Max: | 150mA |
| Package Style: | MLF-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MIC5310-OGYML TR is a part of MIC5310 Series 5.5 V 150 mA tiny Dual Ultra Low-Dropout linear regulator ideally suited for portable electronics due to its high power supply ripple rejection (PSRR) and ultra low output noise
The MIC5310 integrates two high-performance 150 mA ULDOs into a tiny 2mm x 2mm leadless MLF® package, which provides exceptional thermal package characteristics
Features:
- 2.3 V to 5.5 V input voltage range
- Ultra-low dropout voltage ULDO™ 35 mV @ 150 mA
- High PSRR - >70dB @ 1 KHz
- Ultra-low output noise: 30 μVRMS
- ±2% initial output accuracy
- Tiny 8-pin 2mm x 2mm MLF® leadless package
- Excellent Load/Line transient response
- Fast start-up time: 30 μs
- μCap stable with 1 μF ceramic capacitor
- Thermal shutdown protection
- Low quiescent current: 75 μA per output
- Current limit protection
Applications:
- Mobile phones
- PDAs
- GPS receivers
- Portable electronics
- Portable media players
- Digital still and video cameras
Available Packaging
Package Qty:
5000 per Reel
Package Style:
MLF-8
Mounting Method:
Surface Mount