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Manufacturer Part #
MCC310-18IO1
MCC 310 Series 1.32 V 150 mA Surface Mount Thyristor Module
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| Mfr. Name: | Littelfuse - IXYS | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2 per Bag Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Littelfuse - IXYS MCC310-18IO1 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Subject: Inner box packing Label update for Medium Power modules Littelfuse would like to notify you about implementing inner packing box label change for its Medium Power Modules built in our different assembly locations. To harmonize the marking, we will remove Pb-Free marking which is not relevant to all our products portfolio and will only show up a "RoHS compliant" logo which is appropriate to all our power modules. There is no change to fit, form or function of the existing products as the change refers to packing box labelling only.Implementation date: May 1st, 2023 - already in place at some warehouse locations
PCN for Y2 Power Modules Inhouse Assembly Location Transfer MCC310/MCD310/MDD310 types.After the successful relocation of our TO-240, Y4 and Y1 product families in 2020, 2021 and 2022, Littelfuse would like to notify you about the transfer of the backend manufacturing of our MCC310/MCD310/MDD310 Y2 package parts to our inhouse assembly factory in Lipa, Philippines. This new Littelfuse facility combines the very best operational excellence and semiconductor expertise to deliver a highly automated, world class facility designed, to meet IATF16949 & VDA6.3 requirements. Our clear focus being to bring high levels of service to our customers and quality products to support future growth of the power semiconductor business.
PCN for Y2 Power Modules Inhouse Assembly Location Transfer MCC310/MCD310/MDD310 types.After the successful relocation of our TO-240, Y4 and Y1 product families in 2020, 2021 and 2022, Littelfuse would like to notify you about the transfer of the backend manufacturing of our MCC310/MCD310/MDD310 Y2 package parts to our inhouse assembly factory in Lipa, Philippines.This new Littelfuse facility combines the very best operational excellence and semiconductor expertise to deliver a highly automated, world class facility designed, to meet IATF16949 & VDA6.3 requirements. Our clear focus being to bring high levels of service to our customers and quality products to support future growth of the power semiconductor business.
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
Advanced announcement Y2 Power Module Assembly and Test relocationAfter the successful relocation of our TO-240 and Y4 product families, I am pleased to announce that we are preparing to consolidate and transfer the next power modules back end operations to our new facility located in Lipa city, Philipines over the coming months.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCC310-18IO1&field4=Littelfuse - IXYS&field18=https://p1na.futureelectronics.com/p/electromechanical--circuit-protection--power-thyristors/mcc310-18io1-littelfuse-ixys-7016212
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCC310-18IO1&field4=Littelfuse - IXYS&field18=https://p1na.futureelectronics.com/p/electromechanical--circuit-protection--power-thyristors/mcc310-18io1-littelfuse-ixys-7016212
Littelfuse - IXYS MCC310-18IO1 - Technical Attributes
| On-State Voltage [Vtm]: | 1.32V |
| Off-State Current [Idrm]: | 40mA |
| Gate Trigger Current [Igt]-Max: | 150mA |
| On-state RMS Current [Irms]-Max: | 320A |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2 per Bag
Mounting Method:
Surface Mount