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Amphenol Communications Solutions | DILB14P-223TLF

Manufacturer Part #

DILB14P-223TLF

14 Position 2.54 mm Pitch Open Frame Through Hole DIP Socket

ECAD Model:
Mfr. Name: Amphenol Communications Solutions
Standard Pkg:
Product Variant Information section
Date Code: 2528
Product Specification Section
Amphenol Communications Solutions DILB14P-223TLF - Technical Attributes
Attributes Table
Type: DIP Socket
Style: PCB Through Hole
No of Pins: 14
Termination Style/Mounting: Solder
Terminal Pitch: 2.54mm
Contact Material: Copper Alloy
Contact Plating: Tin
Rated Current: 1A
Material: Polyester
Insulation Resistance: 1000MΩ
Operating Temp Range: -55°C to +105°C
No of Rows: 2
Dielectric Withstanding Voltage: 1000V
Mounting Method: Through Hole
Pricing Section
Global Stock:
7,146
USA:
7,146
On Order:
0
Factory Stock:Factory Stock:
0
Factory Lead Time:
10 Weeks
Minimum Order:
34
Multiple Of:
34
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Tariff charges may apply if shipping to the United States. An estimate of tariff charges will be calculated at checkout.
Total
$8.50
USD
Quantity
Unit Price
34
$0.25
170
$0.245
680
$0.24
1,700
$0.235
4,250+
$0.225
Product Variant Information section