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Amphenol Communications Solutions | DILB16P-223TLF

Manufacturer Part #

DILB16P-223TLF

16 Position (2 x 8 ) 2.54 mm Pitch Open Frame Through Hole DIP Socket

ECAD Model:
Mfr. Name: Amphenol Communications Solutions
Standard Pkg:
Product Variant Information section
Date Code: 2236
Product Specification Section
Amphenol Communications Solutions DILB16P-223TLF - Technical Attributes
Attributes Table
Type: DIP Socket
Style: PCB Through Hole
No of Pins: 16
Termination Style/Mounting: Solder
Terminal Pitch: 2.54mm
Contact Material: Copper Alloy
Rated Current: 1A
Material: Polyester
Insulation Resistance: 1000MΩ
Operating Temp Range: -55°C to +105°C
No of Rows: 2
Dielectric Withstanding Voltage: 1000V
Mounting Method: Through Hole
Pricing Section
Global Stock:
114
USA:
114
On Order:
0
Factory Stock:Factory Stock:
0
Factory Lead Time:
10 Weeks
Minimum Order:
75
Multiple Of:
1
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Tariff charges may apply if shipping to the United States. An estimate of tariff charges will be calculated at checkout.
Total
$22.13
USD
Quantity
Unit Price
75
$0.295
200
$0.29
500
$0.285
1,250
$0.28
3,000+
$0.27
Product Variant Information section