Manufacturer Part #
DSC557-0343FI0
MEMS PCIe Clock Generator, -40C-85C, 100ppm
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:110 per Tube | ||||||||||
| Date Code: | 1942 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Product Documents for the DSC557-03 Two Output PCIe Gen1/2/3/4 Clock Generator of devices.Description of Change:1) Conversion of Discera Data Sheet DSC557-03 as Microchip data sheet DS20006318A.2) Added LVDS section to the Section 1.0 Electrical Characteristics table.3) Added LVCMOS section to the Section 1.0 Electrical Characteristics table. Reason for Change: To Improve Productivity Date Document Changes Effective: 18 June 2020
Revision History:January 14, 2020: Issued initial notification.March 04, 2020: Issued final notification. Attached is the qualification report and added the estimated first date by March 31, 2020.Description of Change:Qualification of new bill of materials (BOM) for selected Micrel products available in 14L VQFN (2.5x3.2x0.9mm) package at NSEB assembly site.Pre Change:Using NEX-130CT & 8200T die attach, G770HCD molding compound and Q3-6646 die coat material.Post Change:Using HR-5104 & 2200D die attach, G700LTD molding compound and JCR6109 die coat material.Reason for Change:To improve manufacturability and productivity by qualify new bill of materials (BOM).Change Implementation Status:In ProgressEstimated First Ship Date:March 31, 2020 (date code: 2014)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Notification subject: CCB 3433 Final Notice: Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.PCN Status: Final notification.PCN Type: Manufacturing ChangeDescription of Change: Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Pre Change: Die # 2 Fabricated at Silex Microsystems sitePost Change: Die # 2 Fabricated at Microchip Technology Colorado - Fab 5 site.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Colorado - Fab 5 site.Change Implementation Status: In ProgressEstimated First Ship Date: April 17, 2020 (date code: 2016)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:February 24, 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on April 17, 2020.February 26, 2020: Re-issued final notification. Updated the plant code for die #1 at Taiwan Semiconductor Manufacturing Corp. - Fab 3 from TSMC to TC03 and updated the quality certification for die # 1 at Taiwan Semiconductor Manufacturing Corp. Fab-3.Description of Change:Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Pre Change:Die # 2 Fabricated at Silex Microsystems site.Post Change:Die # 2 Fabricated at Microchip Technology Colorado - Fab 5 site.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Colorado - Fab 5 site.Estimated First Ship Date:April 17, 2020 (date code: 2016)
CCB 3858.001 Initial Notice: Qualification of new bill of materials (BOM) for selected Micrel products available in 14L VQFN (2.5x3.2x0.9mm) package at NSEB assembly sitePCN Status: Initial notificationPCN Type: ManufacturingDescription of Change: Qualification of new bill of materials (BOM) for selected Micrel products available in 14L VQFN (2.5x3.2x0.9mm) package at NSEB assembly site. Pre Change: Using NEX-130CT & 8200T die attach, G770HCD molding compound and Q3-6646 die coat material.Post Change: Using HR-5104 & 2200D die attach, G700LTD molding compound and JCR6109 die coat material.Impacts to Data Sheet: NoneChange Impact: None Reason for Change: To improve manufacturability and productivity by qualify new bill of materials (BOM).Change Implementation Status: In Progress
Product Lifecycle:
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ROHS Compliant -
Lead Free
Available Packaging
Package Qty:
110 per Tube
