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Manufacturer Part #
DSC557-0343FI0
MEMS PCIe Clock Generator, -40C-85C, 100ppm
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:110 per Tube Package Style:QFN-14 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Pre Change: With top mark DCPYYWW at the 2nd line marking. Post Change:With top mark DCPYYWW or DAPYYW at the 2nd line marking.Reason for Change: To improve manufacturability and traceability by implementing top marking changes for DSCxxx and DSAxxx products available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Change Implementation Status:In ProgressEstimated First Ship Date: November 19, 2020 (date code: 2047)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Microchip has released a new Product Documents for the DSC557-03 Two Output PCIe Gen1/2/3/4 Clock Generator of devices.Description of Change:1) Conversion of Discera Data Sheet DSC557-03 as Microchip data sheet DS20006318A.2) Added LVDS section to the Section 1.0 Electrical Characteristics table.3) Added LVCMOS section to the Section 1.0 Electrical Characteristics table. Reason for Change: To Improve Productivity Date Document Changes Effective: 18 June 2020
Revision History:January 14, 2020: Issued initial notification.March 04, 2020: Issued final notification. Attached is the qualification report and added the estimated first date by March 31, 2020.Description of Change:Qualification of new bill of materials (BOM) for selected Micrel products available in 14L VQFN (2.5x3.2x0.9mm) package at NSEB assembly site.Pre Change:Using NEX-130CT & 8200T die attach, G770HCD molding compound and Q3-6646 die coat material.Post Change:Using HR-5104 & 2200D die attach, G700LTD molding compound and JCR6109 die coat material.Reason for Change:To improve manufacturability and productivity by qualify new bill of materials (BOM).Change Implementation Status:In ProgressEstimated First Ship Date:March 31, 2020 (date code: 2014)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Notification subject: CCB 3433 Final Notice: Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.PCN Status: Final notification.PCN Type: Manufacturing ChangeDescription of Change: Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Pre Change: Die # 2 Fabricated at Silex Microsystems sitePost Change: Die # 2 Fabricated at Microchip Technology Colorado - Fab 5 site.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Colorado - Fab 5 site.Change Implementation Status: In ProgressEstimated First Ship Date: April 17, 2020 (date code: 2016)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:February 24, 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on April 17, 2020.February 26, 2020: Re-issued final notification. Updated the plant code for die #1 at Taiwan Semiconductor Manufacturing Corp. - Fab 3 from TSMC to TC03 and updated the quality certification for die # 1 at Taiwan Semiconductor Manufacturing Corp. Fab-3.Description of Change:Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Pre Change:Die # 2 Fabricated at Silex Microsystems site.Post Change:Die # 2 Fabricated at Microchip Technology Colorado - Fab 5 site.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Colorado - Fab 5 site.Estimated First Ship Date:April 17, 2020 (date code: 2016)
CCB 3858.001 Initial Notice: Qualification of new bill of materials (BOM) for selected Micrel products available in 14L VQFN (2.5x3.2x0.9mm) package at NSEB assembly sitePCN Status: Initial notificationPCN Type: ManufacturingDescription of Change: Qualification of new bill of materials (BOM) for selected Micrel products available in 14L VQFN (2.5x3.2x0.9mm) package at NSEB assembly site. Pre Change: Using NEX-130CT & 8200T die attach, G770HCD molding compound and Q3-6646 die coat material.Post Change: Using HR-5104 & 2200D die attach, G700LTD molding compound and JCR6109 die coat material.Impacts to Data Sheet: NoneChange Impact: None Reason for Change: To improve manufacturability and productivity by qualify new bill of materials (BOM).Change Implementation Status: In Progress
Part Status:
Technical Attributes
| Type: | Generator |
| Clock Output Frequency - Max: | 100MHz |
| Supply Voltage-Nom: | 2.25V to 3.6V |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -55°C to +150°C |
| Moisture Sensitivity Level: | 1 |
| Package Style: | QFN-14 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
110 per Tube
Package Style:
QFN-14
Mounting Method:
Surface Mount