Manufacturer Part #
24LC16 Series 16 Kb I2C 2 Wire (2K X 8) 2.5 V Serial EEPROM - PDIP-8
|Standard Pkg:|| |
Product Variant Information section
60 per Tube
Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 or G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship.Estimated First Ship Date:April 30, 2020 (date code: 2018)
Notification subject: Memo # ML01202000QB: Final Notice: Qualification of 36.3K process technology for selected Microchip products of the 24xx08 and 24xx16 device families.PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of 36.3K process technology for selected Microchip products of the 24xx08 and 24xx16device families.Pre Change: Available in 160K wafer technology fabricated at Microchip fabrication sites FAB2 and FAB4 (Tempe, AZ and Gresham, OR, USA) using 8 inch wafersPost Change: Available in 160K wafer technology fabricated at Microchip fabrication sites FAB2 and FAB4 (Tempe, AZ and Gresham, OR, USA) using 8 inch wafers or available in 36.3K wafer technology fabricated at FAB 5 (Colorado Springs, CO, USA) using 6 inch wafers.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve manufacturability by qualifying an additional fabrication site.Change Implementation Status: In ProgressEstimated First Ship Date: April 15, 2020 (date code: 2016)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts
Revision History:December 19, 2019: Issued datasheet DS20001703MJanuary 16, 2020: Re-Issued datasheet DS20001703M by narrowing the scope to affect only parts based on the device selection table.Description of Change:1) Added the 24FC16 device 2) Updated Package Drawings 3) Updated formating throughout for clarification.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 16 Jan 2020.NOTE: Please be advised that this is a change to the document only the product has not been changed.
|Memory Organization:||2 K x 8|
|Supply Voltage-Nom:||2.5V to 5.5V|
|Write Cycle Time-Max (tWC):||5ms|
|Mounting Method:||Through Hole|
Features & Applications
The 24AA16/24LC16B (24XX16*) is a 16 Kbit Electrically Erasable PROM. The device is organized as eight blocks of 256 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7 V with standby and active currents of only 1 μA and 1 mA, respectively.
The 24XX16 also has a page write capability for up to 16 bytes of data. The 24XX16 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN and MSOP packages, and is also available in the 5-lead SOT-23 package.
- Single supply with operation down to 2.5 V for 24LC16B devices
- Low-power CMOS technology
- 2-wire serial interface, I2C™ compatible
- Schmitt Trigger inputs for noise suppression
- Output slope control to eliminate ground bounce
- 100 kHz (2.5 V) and 400 kHz clock compatibility
- Page write time 5 ms max.
- More than 1 million erase/write cycles
- Data retention > 200 years
60 per Tube