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Manufacturer Part #
AT24C256C-XHL-T
Download the CAD models for this product. Learn more about SnapMagic.
5000 per Reel
TSSOP-8
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: This qualification was originally performed to qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change: Microchip has decided to not qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.
***FPCN110207 UPDATE***Revision History:May 22, 2023: Issued initial notification.July 01, 2024: Issued final notification. Attached the Qualification Report. Updated the pre and post change summary table to include Lead frame design information. Provided estimated first ship date to be on July 22, 2024.November 29, 2024: Re-issued final notification to reflect wire material Au in ANAP and ASSH assembly sites in the Pre and Post Change Summary.January 15, 2025: Re-issued final notification to reflect mold compound CEL-8240HF10P material in ANAP assembly site in the Pre and Post Change Summary. January 23, 2025: Re-issued the final notification to revise the comparison PDF file and reflect the mold compound CEL-8240HF10P material in ANAP assembly site.Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Description:CCB 6017 Final Notice: Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
***July 01, 2024: Issued final notification. Attached the Qualification Report***Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.