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Manufacturer Part #
MIC2774L-25YM5-TR
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:3000 per Std. Mfr. Pkg |
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Microchip MIC2774L-25YM5-TR - Product Specification
Shipping Information:
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Description of Change:Qualification of a new lead frame design and G700 as a new mold compound material for selected MIC277xxx device family available in 5L SOT-23 package assembled at STAR assembly site.Reason for Change:To improve productivity by qualifying a new lead frame design and G700 mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:February 10, 2023 (date code: 2306)
Part Status:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC2774L-25YM5-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/mic2774l-25ym5-tr-C016308942
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC2774L-25YM5-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/mic2774l-25ym5-tr-C016308942
Available Packaging
Package Qty:
3000 per Std. Mfr. Pkg