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Manufacturer Part #
MCP3221A6T-E/OT
Single Channel I2C Interface 5.5 V 22.3 kbps 12-Bit A/D Converter - SOT-23-5
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-5 (SOT-25) Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP3221A6T-E/OT - Product Specification
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Description of Change:Following is the list of changes for this revision:• Added AEC-Q100 Qualification to Features and General Description.• Added Related Devices.• Updated the temperature range from industrial (-40°C to +85°C) to extended (-40°C to +125°C) in Section 1.0, "Electrical Specifications".• Updated Table 1-1, "DC Electrical Specifications" notes.• Updated Product Identification System.• Added Product Identification System (Automotive).Reason for Change: To improve productivity.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx,TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx, TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Microchip MCP3221A6T-E/OT - Technical Attributes
| Interface: | I2C |
| No of Channels: | 1 |
| Resolution: | 12b |
| Supply Voltage: | 2.7V to 5.5V |
| Sampling Rate: | 22.3kbps |
| Operating Temp Range: | -40°C to +125°C |
| Storage Temperature Range: | -65°C to +150°C |
| Package Style: | SOT-23-5 (SOT-25) |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount