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Manufacturer Part #
TC7109ACKW
Single Channel Parallel Interface 5 V 30 bps 12-Bit A/D Converter - PQFP-44
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| Mfr. Name: | Microchip | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:96 per Tray Package Style:PQFP-44 Mounting Method:Surface Mount |
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Microchip TC7109ACKW - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 111596 ***Revision History: March 10, 2025: Issued final notification.March 17, 2025: Re-issued the PCN notification to update the revision history stating from final notification to initial notification.October 18, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 10, 2025. Updated the reason for change to include QM519 die attach material and included in Pre and Post change table that QMI519 is a PFAS-free material. Attached the PFAS Elimination and Die Attach Elimination file.Description of Change: Qualification of MMT as a new assembly site for TC7126CKW, TC7126ACKW, TC7126CKW713 and TC7126ACKW713 catalog part numbers (CPN) and QMI519 as a new die attach material for TC7106, TC7106A, TC7107, TC7107A, TC7109, TC7109A, TC7116, TC7116A, TC7117, TC7117A, TC7126, TC7126A and TC7129 device families available in 44L MQFP (10x10x2mm) package.Reason for Change: To improve on-time delivery performance and manufacturability by qualifying MMT as a new assembly site and QMI519 as a new die attach material.Estimated First Ship Date: 10 November 2025 (date code: 2546)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:• Pre Change: Fabrication Site = Microchip Technology Tempe – Fab 2(TMGR), Wafer Size = 8"• Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO – Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of MMT as a new assembly site for TC7126CKW, TC7126ACKW, TC7126CKW713 and TC7126ACKW713 catalog part numbers (CPN) and QMI519 as a new die attach material for TC7106, TC7106A, TC7107, TC7107A, TC7109, TC7109A, TC7116, TC7116A, TC7117, TC7117A, TC7126, TC7126A and TC7129 device families available in 44L MQFP (10x10x2mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2025
Description of Change: Qualification of MMT as a new assembly site for TC7126CKW, TC7126ACKW, TC7126CKW713 and TC7126ACKW713 catalog part numbers (CPN) and QMI519 as a new die attach material for TC7106, TC7106A, TC7107, TC7107A, TC7109, TC7109A, TC7116, TC7116A, TC7117, TC7117A, TC7126, TC7126A and TC7129 device families available in 44L MQFP (10x10x2mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as a new assembly site.
Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO – Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:• Pre Change: Fabrication Site = Microchip Technology Tempe – Fab 2(TMGR), Wafer Size = 8"• Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
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Microchip TC7109ACKW - Technical Attributes
| Interface: | Parallel |
| No of Channels: | 1 |
| Resolution: | 12b |
| Supply Voltage: | 5V |
| Sampling Rate: | 30bps |
| Operating Temp Range: | 0°C to 70°C |
| Storage Temperature Range: | -65°C to +150°C |
| Package Style: | PQFP-44 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
96 per Tray
Package Style:
PQFP-44
Mounting Method:
Surface Mount