Manufacturer Part #
MCP4716A0T-E/CH
SINGLE, 10-BIT NV DAC WITH EXT VREF AND I2C INTERFACE
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-6 (SOT-26) Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP4716A0T-E/CH - Product Specification
Shipping Information:
ECCN:
PCN Information:
CCB 7276 Final NoticeDescription of Change: Qualification palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421, MCP4725, MCP4726, MCP4706, MCP4716, MCP9510, MCP47DA1, MCP4023, MCP4022, MCP4013, MCP4012, and MCP3425 device families available in 6L SOT-23 package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 07 March 2025 (date code: 2510)Revision History: November 13, 2024: Issued initial notification.January 31, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on March 07, 2025.
Description of Change: Qualification palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421, MCP4725, MCP4726, MCP4706, MCP4716, MCP9510, MCP47DA1, MCP4023, MCP4022, MCP4013, MCP4012, and MCP3425 device families available in 6L SOT-23 package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status:In ProgressEstimated First Ship Date:February 16, 2023 (date code: 2307)
Part Status:
Microchip MCP4716A0T-E/CH - Technical Attributes
| Interface: | I2C |
| No of Channels: | 1 |
| Power Consumption: | 452mW |
| Resolution: | 10b |
| Supply Voltage: | 2.7V to 5.5V |
| Settling Time: | 6µs |
| On-Chip DAC: | 1-chx10-bit |
| Operating Temp Range: | -40°C to +125°C |
| Storage Temperature Range: | -65°C to +150°C |
| Moisture Sensitivity Level: | 1 |
| Package Style: | SOT-23-6 (SOT-26) |
| Mounting Method: | Surface Mount |
Features & Applications
Features:
- Rail-to-Rail Output
- Fast Settling Time of 6 μs (typical)
- Nonvolatile Memory (EEPROM)
- Auto Recall of Saved DAC register setting
- Auto Recall of Saved Device Configuration (Voltage Reference, Gain, Power Down)
- Power-Down Modes
- Disconnects output buffer
- Selection of VOUT pull-down resistors (640 kΩ, 125 kΩ, or 1 kΩ)
- Low Power Consumption
- Normal Operation: 210 μA typ.
- Power Down Operation: 60 nA typ. (PD1:PD0 = “11”)
- I2C™ Interface:
- Eight Available Addresses
- Standard (100 kbps), Fast (400 kbps), and High-Speed (3.4 Mbps) Modes
- DAC Voltage Reference Options
- VDD
- VREF Pin
- Output Gain Options
- Unity (1x)
- 2x, only when VREF pin is used as voltage source
- Small 6-lead SOT-23 and DFN (2x2) Packages
- Extended Temperature Range: -40°C to +125°C
Applications:
- Set Point or Offset Trimming
- Sensor Calibration
- Low Power Portable Instrumentation
- PC Peripherals
- Data Acquisition Systems
- Motor Control
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount