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Manufacturer Part #
MCP4716A3T-E/CH
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3000 per Reel
SOT-23-6 (SOT-26)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
CCB 7276 Final NoticeDescription of Change: Qualification palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421, MCP4725, MCP4726, MCP4706, MCP4716, MCP9510, MCP47DA1, MCP4023, MCP4022, MCP4013, MCP4012, and MCP3425 device families available in 6L SOT-23 package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 07 March 2025 (date code: 2510)Revision History: November 13, 2024: Issued initial notification.January 31, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on March 07, 2025.
Description of Change: Qualification palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421, MCP4725, MCP4726, MCP4706, MCP4716, MCP9510, MCP47DA1, MCP4023, MCP4022, MCP4013, MCP4012, and MCP3425 device families available in 6L SOT-23 package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status:In ProgressEstimated First Ship Date:February 16, 2023 (date code: 2307)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
The VREF pin or the device VDD can be selected as the DAC’s reference voltage. When VDD is selected, VDD is connected internally to the DAC reference circuit. When the VREF pin is used, the user can select the output buffer’s gain to 1 or 2. When the gain is 2, the VREF pin voltage should be limited to a maximum of VDD/2.
The DAC Register value and configuration bits can be programmed to nonvolatile memory (EEPROM). Thenonvolatile memory holds the DAC Register and configuration bit values when the device is powered off. A device reset (such as a Power On Reset) latches these stored values into the volatile memory.
Features:
Applications:
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