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MCP1416RT-E/OT
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3000 par Reel
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Informations PCN:
*** Update for FPCN 119453 ***Revision History:November 20, 2025: Issued initial notification. February 13, 2026: Re-issued initial notification to add MCP1401T-E/OT, MCP1402T-E/OT, MCP1416T-E/OT and MCP1415T-E/OT catalog part numbers in the affected parts list. Updated notification subject, qualification plan title and purpose to reflect the additional parts. Updated the pre and post change table to add CRM-1151GA die attach material in the pre change. Revised the Estimated Qualification Completion Date from November 2025 to February 2026.March 4, 2026: Issued final notification. Attached Qualification Report. Provided estimated first ship date to be on March 15, 2026. March 11, 2026: Re-issued final notification to update the 'Change' column for die attach material from 'No' to 'Yes'.Description of Change: Qualification of CuPdAu as a new wire material for MCP1401T-E/OT, MCP1402T-E/OT, MCP1416RT-E/OT, MCP1415RT-E/OT, MCP1416T-E/OT and MCP1415T-E/OT catalog part numbers (CPN) available in 5L SOT-23 package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated First Ship Date: 15 March 2026 (date code: 2611)
*** Update of FPCN 117502/Wire Material Change ***Revision History: November 20, 2025: Issued initial notification. February 13, 2026: Re-issued initial notification to add MCP1401T-E/OT, MCP1402T-E/OT, MCP1416T-E/OT and MCP1415T-E/OT catalog part numbers in the affected parts list. Updated notification subject, qualification plan title and purpose to reflect the additional parts. Updated the pre and post change table to add CRM-1151GA die attach material in the pre change. Revised the Estimated Qualification Completion Date from November 2025 to February 2026.March 4, 2026: Issued final notification. Attached Qualification Report. Provided estimated first ship date to be on March 15, 2026. Description of Change: Qualification of CuPdAu as a new wire material for MCP1401T-E/OT, MCP1402T-E/OT, MCP1416RT-E/OT, MCP1415RT-E/OT, MCP1416T-E/OT and MCP1415T-E/OT catalog part numbers (CPN) available in 5L SOT-23 package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated First Ship Date: 15 March 2026 (date code: 2611)
*** Update for PCN 117502 ***Revision History: November 20, 2025: Issued initial notification. February 13, 2026: Re-issued initial notification to add MCP1401T-E/OT, MCP1402T-E/OT, MCP1416T-E/OT and MCP1415T-E/OT catalog part numbers in the affected parts list. Updated notification subject, qualification plan title and purpose to reflect the additional parts. Updated the pre and post change table to add CRM-1151GA die attach material in the pre change. Revised the Estimated Qualification Completion Date from November 2025 to February 2026.Description of Change: Qualification of CuPdAu as a new wire material for MCP1401T-E/OT, MCP1402T-E/OT, MCP1416RT-E/OT, MCP1415RT-E/OT, MCP1416T-E/OT and MCP1415T-E/OT catalog part numbers (CPN) available in 5L SOT-23 package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated Qualification Completion Date: February 2026
Description of Change: Qualification of CuPdAu as a new wire material for MCP1415RT-E/OT and MCP1416RT-E/OT catalog part numbers (CPN) available in 5L SOT-23 package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material. Estimated Qualification Completion Date: November 2025
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
