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MIC38HC43YM-TR
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2500 par Reel
SOIC-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for selected MIC2012, MIC2025, MIC2026, MIC2042, MIC2043, MIC2075, MIC2076, MIC2172, MIC2536, MIC2544, MIC2544A, MIC2545A, MIC2548, MIC2548A, MIC2549A, MIC2582, MIC2587, MIC29201, MIC29204, MIC2951, MIC2954, MIC3172, MIC3203, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC38HC42, MIC38HC43, MIC38HC44, MIC38HC45, MIC4223, MIC4224, MIC4225, MIC4801, MIC5014, MIC5015, MIC5020, MIC5021, MIC5156, MIC5200, MIC5201 and MIC5202 device families available in 8L SOIC (.150in) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
UPDATE TO PCN 110887.Revision History: February 14, 2025: Issued initial notification.September 10, 2025: Issued final notification. Updated scope to remove MIC5200, MIC5201, MIC5202 device families and MIC5841YV-TR catalog part number and add 835-5043, LP2951, MIC2172, MIC2915x, MIC2920x, MIC2930xx, MIC2931x, MIC29371, MIC2941A, MIC29502, MIC2951, MIC2951x, MIC2954, MIC297xx, MIC2981, MIC3172, MIC37252, MIC37303, MIC3750x, MIC38C43, MIC38HC4x, MIC3915x, MIC3930x, MIC3950x, MIC3975, MIC457x, MIC501x, MIC502x, MIC5060, MIC515x, MIC580x and MIC58Pxx device families. Attached Qualification Report. Provided estimated first ship date to be on October 31, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: September 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Statut du produit:
The MIC38HC43YM TR family are fixed frequency current-mode PWM controllers with 1 A drive current capability. Micrel’s BiCMOS devices are pin-compatible with 384x bipolar devices. Their high output drive, with fast rise and fall times, combined with low startup current make it an ideal PWM controller where high efficiency is required.
Undervoltage lockout circuitry allows the ’42 and ’44 versions to start up at 14.5 V and operate down to 9 V, and the ’43 and ’45 versions start at 8.4 V with operation down to 7.6 V. All versions operate up to 20 V. When compared to bipolar UC384x devices operating from a 15 V supply, start-up current has been reduced to 50 µA typical and operating current has been reduced to 4.0 mA typical. Decreased output rise and fall times drive larger MOSFETs, and rail-to-rail output capability increases efficiency, especially at lower supply voltages. The MIC38HC43YM TR also features a trimmed oscillator discharge current and bandgap reference. MIC38HC4x-1 is available in 14-pin plastic DIP and SOIC packages. 8-pin devices feature small size, while 14-pin devices separate the analog and power connections for improved performance and power dissipation.
Key Features:
Applications:
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Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.