Manufacturer Part #
MCP73832T-2ATI/OT
MCP73832 Series 6 V Single-Cell Li-Ion/Li-Polymer Battery Charge Controller
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-5 (SOT-25) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2226 | ||||||||||
Microchip MCP73832T-2ATI/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN115155***Revision History: August 12, 2025: Issued initial notification.October 16, 2025: Issued final notification. Updated affected part list to removeDescription of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 06 November 2025 (date code: 2545)
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
***UPDATE OF PCN113107***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP4014, MCP4024, MCP6421, MCP6471, MCP6481, MCP6491, MCP6V11xx, MCP6V16xx, MCP6V31xx, MCP6V36xx, MCP6V61xx, MCP6V66xx, MCP6V71xx, MCP6V76xx, MCP6V81xx, MCP6V86xx, MCP6V91xx, MCP6V96xx, MCP73811, MCP73812, MCP73831, MCP73832, MCP9501, MCP9502, MCP9503, MCP9504, MCP9509, MCP9800, MCP9802 and MIC333 device families in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new bond wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)Revision History: May 16, 2025: Issued final notification.May 22, 2025: Re-issued final notification to update the Qualification Report.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP4014, MCP4024, MCP6421, MCP6471, MCP6481, MCP6491, MCP6V11xx, MCP6V16xx, MCP6V31xx, MCP6V36xx, MCP6V61xx, MCP6V66xx, MCP6V71xx, MCP6V76xx, MCP6V81xx, MCP6V86xx, MCP6V91xx, MCP6V96xx, MCP73811, MCP73812, MCP73831, MCP73832, MCP9501, MCP9502, MCP9503, MCP9504, MCP9509, MCP9800, MCP9802 and MIC333 device families in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new bond wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)
***FPCN108989 UPDATE***Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Revision History: November 18, 2024: Issued initial notification.January 27, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated firstship date to be on February 28, 2025.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach materialand CuPdAu as a new wire material
Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach material and CuPdAu as a new wire material
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Microchip MCP73832T-2ATI/OT - Technical Attributes
| Configuration: | Linear |
| Number of Cells: | 1 |
| Supply Voltage: | 3.75V to 6V |
| Operating Temp Range: | -40°C to +85°C |
| Package Style: | SOT-23-5 (SOT-25) |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP73832T-2ATI/OT is a 6V, miniature single-cell, fully integrated Li-Ion/Li-Polymer Charge Management Controller designed for use in space limited and cost sensitive applications.
The MCP73832 is available in an 8-Lead, 2 mm x 3 mm DFN package or a 5-Lead, SOT-23 package.
Features:
- Linear Charge Management Controller:
- Integrated Pass Transistor
- Integrated Current Sense
- Reverse Discharge Protection
- High Accuracy Preset Voltage Regulation: + 0.75%
- Four Voltage Regulation Options:
- 4.20V, 4.35V, 4.40V, 4.50V
- Programmable Charge Current: 15 mA to 500 mA
- Selectable Preconditioning:
- 10%, 20%, 40%, or Disable
- Selectable End-of-Charge Control:
- 5%, 7.5%, 10%, or 20%
- Charge Status Output
- Tri-State Output - MCP73831
- Open-Drain Output - MCP73832
- Automatic Power-Down
- Thermal Regulation
- Temperature Range: -40°C to +85°C
- Packaging:
- 8-Lead, 2 mm x 3 mm DFN
- 5-Lead, SOT-23
Applications:
- Lithium-Ion/Lithium-Polymer Battery Chargers
- Personal Data Assistants
- Cellular Telephones
- Digital Cameras
- MP3 Players
- Bluetooth Headsets
- USB Chargers
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount