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Manufacturer Part #
MCP73833T-FCI/MF
MCP73833 Series 6 V 1 A Highly Advanced Linear Charge Management Controller
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:DFN-10 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP73833T-FCI/MF - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change:Qualification of UTL3 as an additional assembly site for selected MCP42xx, MCP46xx, MCP738xx and MCP34xx device families available in 10L DFN (3x3x0.9mm) package.Impacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve manufacturability and productivity by qualifying UTL3 as an additional assembly site.Change Implementation Status:In Progress Estimated First Ship Date:March 30, 2022 (date code: 2214)
PCN Status: Initial notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of UTL3 as an additional assembly site for selected MCP42xx, MCP46xx, MCP738xx and MCP34xx device families available in 10L DFN (3x3x0.9mm) package.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve manufacturability and productivity by qualifying UTL3 as an additional assembly siteChange Implementation Status: In ProgressEstimated Qualification Completion Date:January 2022
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
Microchip MCP73833T-FCI/MF - Technical Attributes
| Configuration: | Linear |
| Number of Cells: | 1 |
| Supply Voltage: | 3.75V to 6V |
| Input Voltage-Max: | 7V |
| Output Voltage: | 4.2V |
| Supply Current: | 2mA |
| Output Current: | 1A |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| No of Terminals: | 10 |
| Moisture Sensitivity Level: | 1 |
| Package Style: | DFN-10 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
DFN-10
Mounting Method:
Surface Mount