
Manufacturer Part #
MCP1700T-3002E/TT
250MA CMOS LDO, ISUPPLY 1UA AND 2% VOUT ACCURACY
Microchip MCP1700T-3002E/TT - Product Specification
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Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23(1.3mm) package.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
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Microchip MCP1700T-3002E/TT - Technical Attributes
Input Voltage-Min: | 2.3V |
Input Voltage-Max: | 6V |
Output Voltage Fixed: | 3V |
Dropout Voltage-Max: | 350mV |
Output Current-Max: | 250mA |
Rated Power: | 369.6mW |
Tolerance (%): | ±0.4% |
Operating Temp Range: | -40°C to +125°C |
Regulator Topology: | Fixed |
Quiescent Current: | 4µA |
No. of Outputs: | Single |
Output Noise: | 3µV |
Load Regulation (%): | 1.5% |
Line Regulation (%): | 1% |
Package Style: | SOT-23 (SC-59,TO-236) |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23 (SC-59,TO-236)
Mounting Method:
Surface Mount