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Manufacturer Part #
MCP1725-ADJE/MC
500MA CMOS LDO, ADJUSTABLE VOUT, POWERGOOD, SHUTDOWN
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:150 per Tube Package Style:DFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 1828 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Product Lifecycle:
Technical Attributes
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 6V |
| Output Voltage Fixed: | 0.8V/5V |
| Dropout Voltage-Max: | 350mV |
| Output Current-Max: | 500mA |
| Package Style: | DFN-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The 500 mA output current capability, combined with the low output voltage capability, make the MCP1725 a good choice for new sub-1.8 V output voltage LDO applications that have high current demands. The MCP1725 is stable using ceramic output capacitors that inherently provide lower output noise and reduce the size and cost of the entire regulator solution. Only 1 μF of output capacitance is needed to stabilize the LDO.
Features:
- Up to 500 mA output load current
- Low dropout voltage: 210 mV typical at 500 mA
- Output voltage from 0.8 V to 5.0 V, both fixed and adjustable
- Stable with 1.0 µF ceramic output capacitor
- Power good output with adjustable delay
- Low supply current: 120 µA (typ)
- Low shutdown current: 0.1 µA (typ)
- DFN-8 2x3 and SOIC-8 Pb-free packages
Applications:
- High-Speed Driver Chipset Power
- Networking Backplane Cards
- Notebook Computers
- Network Interface Cards
- Palmtop Computers
- Video Graphics Adapters
- 2.5 V to 1.X V Regulators
Available Packaging
Package Qty:
150 per Tube
Package Style:
DFN-8
Mounting Method:
Surface Mount
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