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Référence fabricant
MIC5219-5.0YMT-TR
500MA PEAK OUTPUT LDO
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :SOT-23-5 (SOT-25) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC5219-5.0YMT-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***UPDATE OF PCN110834***Description of Change: CCB 7364.004 Final Notice: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected LM4040, LM4041, MIC23158, MIC23159, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC4043, MIC4680, MIC4681, MIC4682, MIC4684, MIC4685, MIC4690, MIC5201, MIC5203, MIC5205, MIC5206, MIC5207, MIC5208, MIC5209, MIC5210, MIC5211, MIC5212, MIC5213, MIC5216, MIC5219, MIC5234, MIC5236, MIC5237, MIC5238, MIC5239, MIC5270, MIC5271, MIC6211, MIC6270, MIC79050, MM5450 and MM5451 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC5219, MIC5323, MIC5305, MIC5325, MIC2033, MIC2039, and MIC2790 device families available in 6L UDFN (2x2x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5207, MIC5209, MM5450, MM5451, MIC38C44, MIC38C45, MIC38C42, MIC38C43, MIC5233, MIC5205, MIC5235, MIC5219, MIC5225, MIC4684, MIC5239, MIC5236, MIC5234,MIC5238, MIC5210, MIC79050, MIC5212, MIC5201, MIC3490, MIC4685, MIC5295, MIC4680, and MIC5237 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
***July 24, 2024: Re-issued final notification to include the Qual Report. Modified the time table summary to reflect Qual Report availability from August to July***Description of Change:Qualification of MMT as an additional assembly site for MIC5219-5.0YMT45M-TR, MIC5219-5.0YMT-TR and MIC5219YMT-TR catalog part numbers (CPN) available in 6L UDFN (2x2x0.6mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
***June 28, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add CPN MIC5219-5.0YMT45M-TR***Description of Change:Qualification of MMT as an additional assembly site for MIC5219-5.0YMT45M-TR, MIC5219-5.0YMT-TR and MIC5219YMT-TR catalog part numbers (CPN) available in 6L UDFN (2x2x0.6mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Revision History:September 12, 2022: Issued initial notification.November 15, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 19, 2022Description of Change:Qualification of MTAI as an additional final test site for MIC5219-5.0YMT-TR and MIC5219YMT-TR catalog part numbers (CPN) available in 6L UDFN (2x2x0.6mm) package.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional final test site.
Statut du produit:
Microchip MIC5219-5.0YMT-TR - Caractéristiques techniques
| Input Voltage-Min: | 2.5V |
| Input Voltage-Max: | 12V |
| Output Voltage Fixed: | 5V |
| Dropout Voltage-Max: | 500mV |
| Output Current-Max: | 500mA |
| Style d'emballage : | SOT-23-5 (SOT-25) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
SOT-23-5 (SOT-25)
Méthode de montage :
Surface Mount