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Manufacturer Part #
MIC23031-FYMT-TR
MIC23031 Series 4MHz 400mA Sync Buck Regulator w/ HyperLight Load™ Mode - TMLF-6
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:TMLF-6 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC23031-FYMT-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
*** Update for PCN 112974 ***Revision History: May 13, 2025: Issued initial notification.July 23, 2025: Issued final notification. Attached Qualification Report. Provided estimated first ship date to be on July 31, 2025.Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC94345, MIC2095, MIC2097, MIC2098, MIC2099, MIC23030, MIC23031, MIC2791, MIC5265, MIC5301, MIC5304, MIC5308, MIC5309, MIC5318, MIC5320, MIC5321, MIC5322, MIC5335, MIC5353, MIC5367, MIC5368, MIC5370, MIC5371, MIC5512, MIC5514, MIC826, MIC841, MIC94305, MIC94325 and MIC94355 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.Estimated First Ship Date: 31 July 2025 (date code: 2531)
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC94345, MIC2095, MIC2097, MIC2098, MIC2099, MIC23030, MIC23031, MIC2791, MIC5265, MIC5301, MIC5304, MIC5308, MIC5309, MIC5318, MIC5320, MIC5321, MIC5322, MIC5335, MIC5353, MIC5367, MIC5368, MIC5370, MIC5371, MIC5512, MIC5514, MIC826, MIC841, MIC94305, MIC94325 and MIC94355 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC23031-FYMT-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--regulators-reference--switching-regulators/mic23031-fymt-tr-microchip-5217823
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC23031-FYMT-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--regulators-reference--switching-regulators/mic23031-fymt-tr-microchip-5217823
Microchip MIC23031-FYMT-TR - Technical Attributes
| Topology: | Buck |
| Input Voltage: | 2.7V to 5.5V |
| Output Current-Max: | 400mA |
| Output Type: | Fixed |
| Switching Frequency-Max: | 4MHz |
| Operating Temp Range: | -40°C to +125°C |
| Duty Cycle-Max: | 80% |
| Efficiency: | 93% |
| No. of Outputs: | 1 |
| Quiescent Current: | 35µA |
| Storage Temperature Range: | -65°C to +150°C |
| Load Regulation (%): | 0.7% |
| Package Style: | TMLF-6 |
| Mounting Method: | Surface Mount |
Features & Applications
An additional benefit of this proprietary architecture is very low output ripple voltage throughout the entire load range with the use of small output capacitors. The tiny 1.6 mm x 1.6 mm Thin MLF ® package saves precious board space and requires only three external components.The MIC23031 has a very low quiescent current of 21 µA and achieves as high as 88% efficiency at 1 mA. At higher loads, the MIC23031 provides a constant switching frequency around 4 MHz while achieving peak efficiencies up to 93%.
Features:
- Input voltage range: 2.7 V to 5.5 V
- 400 mA output current
- Up to 93% efficiency and 88% at 1 mA
- 21 µA typical quiescent current
- 4 MHz PWM operation in continuous mode
- Ultra fast transient response
- Low voltage output ripple
- 20 mVpp ripple in Hyper Light Load TM mode
- 3 mV output voltage ripple in full PWM mode
- Fully integrated MOSFET switches
- 0.01 µA shutdown current
- Thermal shutdown and current limit protection
- Fixed and adjustable output voltage options available
- 6-pin 1.6 mm x 1.6 mm Thin MLF ®
- –40 °C to +125 °C junction temperature range
Applications:
- Mobile Handsets
- Portable Media/MP3 Players
- Poryable Navigation Devices(GPS)
- WiFi/WiMax/WiBro Modules
- Digital Cameras
- Wireless LAN cards
Available Packaging
Package Qty:
5000 per Reel
Package Style:
TMLF-6
Mounting Method:
Surface Mount