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HCS301-I/SN
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100 per Tube
SOIC-8
Surface Mount
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***UPDATE OF PCN112604, PCN118605, PCN118767***Revision History: April 29, 2025: Issued initial notification.January 06, 2026: Issued final notification. Provided estimated first ship date. Updated affected parts list to include HCS301/SN032 and HCS301T/SN032 catalog part numbers. Added a Change (Yes/No) column to the Pre and Post Change Summary table. Revised affected parts list.January 14, 2026: Re-issued the final notification to attach the excel file titled CENO21QUOU280_Affected_Parts_List. January 21, 2026: Re-issued the Final notification to update the excel file titled CENO21QUOU280_Affected_Parts_List by removing the duplicate parts.April 30, 2026: Re-issued final notification to attached the Qualification Report.Product Category: 8-Bit Microcontrollers, KEELOQ Decoder Devices, KEELOQ Encoder Devices, KEELOQ Transcoder DevicesDescription of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for HCS301, HCS300, HCS362, HCS200, PIC16F84, HCS512, HCS410, HCS361, HCS360, PIC16C57, HCS320, PIC16C54, PIC16HV540, CF775, PIC16F83 device families of 77K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 16 January 2026 (date code: 2603)
***UPDATE OF PCN112604, PCN118605/LOCATION CHANGE***Revision History:April 29, 2025: Issued initial notification. January 06, 2026: Issued final notification. Provided estimated first ship date. Updated affected parts list to include HCS301/SN032 and HCS301T/SN032 catalog part numbers. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.January 14, 2026: Re-issued the final notification to attach the excel file titled CENO-21QUOU280_Affected_Parts_List. This file provides the Estimated First Ship Date for each affected parts.January 21, 2026: Re-issued the Final notification to update the excel file titled CENO-21QUOU280_Affected_Parts_List by removing the duplicate parts.PCN Type:Manufacturing ChangeDescription of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for HCS301, HCS300, HCS362, HCS200, PIC16F84, HCS512, HCS410, HCS361, HCS360, PIC16C57, HCS320, PIC16C54, PIC16HV540, CF775, PIC16F83 device families of 77K technology available in various packages. Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.*Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: 31 March 2026Estimated First Ship Date: 16 January 2026 (date code: 2603)
*** Update for PCN 112604 (LOCATION CHANGE) ***Revision History:April 29, 2025: Issued initial notification. January 06, 2026: Issued final notification. Provided estimated first ship date. Updated affected parts list to include HCS301/SN032 and HCS301T/SN032 catalog part numbers. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.January 14, 2026: Re-issued the final notification to attach the excel file titled CENO21QUOU280_Affected_Parts_List. This file provides the Estimated First Ship Date for each affected parts.Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for HCS301, HCS300, HCS362, HCS200, PIC16F84, HCS512, HCS410, HCS361, HCS360, PIC16C57, HCS320, PIC16C54, PIC16HV540, CF775, PIC16F83 device families of 77K technology available in various packages. Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:31 March 2026Estimated First Ship Date:16 January 2026 (date code: 2603)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for HCS301, HCS300, HCS362, HCS200, PIC16F84, HCS512, HCS410, HCS361, HCS360, PIC16C57, HCS320, PIC16C54, PIC16HV540, CF775, PIC16F83 device families of 77K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
The HCS301 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS301 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low cost, to make this device a perfect solution for unidirectional remote keyless entry systems and access control systems.
The HCS301 combines a 32-bit hopping code generated by a non-linear encryption algorithm, with a 28-bit serial number and six status bits to create a 66-bit transmission stream. The length of the transmission eliminates the threat of code scanning and the code hopping mechanism makes each transmission unique, thus rendering code capture and re-send (code grabbing) schemes useless. The encryption key, serial number, and configuration data are stored in EEPROM, which is not accessible via any external connection. This makes the HCS301 a very secure unit. The HCS301 provides an easy-to-use serial interface for programming the necessary security keys, system parameters, and configuration data. Additional features include an LED Drive, Overflow bits, Time-out, and Battery low indicator. The HCS301 operates in a voltage range of 3.5 V to 13.0 V.
Features:
Security
Operating
Other
Applications:
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