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Référence fabricant
MCP2155-I/SO
Bi-Directional 5.5 V 115.2 kbd Standard Stack Controller Surface Mount - SOIC-18
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :42 par Tube Style d'emballage :SOIC-18 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP2155-I/SO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC.Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP2155-I/SO&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--comm-products--controllers/mcp2155-i-so-microchip-5917398
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP2155-I/SO&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--comm-products--controllers/mcp2155-i-so-microchip-5917398
Microchip MCP2155-I/SO - Caractéristiques techniques
| Supply Voltage-Nom: | 5.5V |
| Interface: | UART |
| Style d'emballage : | SOIC-18 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Features:
- Implements the IrDA® standard including:- IrLAP,IrLMP,IAS,TinyTP,IrCOMM (9-wire “cooked” service class
- Provides IrDA standard physical signal layer support including:
- Bidirectional communication
- CRC implementation
- Data communication rates up to 115.2 kbaud
- Includes UART to IrDA standard encoder/decoder functionality:
- Easily interfaces with industry standard UARTs and infrared transceivers
- UART interface for connecting to Data Terminal Equipment (DTE) systems
- Transmit/Receive formats (bit width) supported:- 1.63μs
- Hardware baud rate selection for UART:-9.6 kbaud,19.2 kbaud,57.6 kbaud, 115.2 kbaud
- Infrared baud rates supported:-9.6 kbaud,19.2 kbaud,38.4 kbaud,57.6 kbaud, 115.2 kbaud
- 64 Byte Data Packet Size
- Programmable Device ID String
- Operates as Secondary Device
Emballages disponibles
Qté d'emballage(s) :
42 par Tube
Style d'emballage :
SOIC-18
Méthode de montage :
Surface Mount