Manufacturer Part #
MCP23008T-E/SO
MCP23008 Series 5.5 V 1.7 MHz 8-Bit I/O Expander with Serial Interface - SOIC-18
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1100 per Reel Package Style:SOIC-18 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP23008T-E/SO - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Datasheet for the MCP23008/MCP23S08 8-Bit I/O Expander with Serial Interface of devices.Description of Change: Revision Includes:� Updated description in Section �Features�.� Updated Table 1-1.� Corrected drawings for MCP23008 in Section Package Types.� Corrected Section 1.6.1 �I/O Direction (IODIR) Register�� Corrected packages drawings in Section 3.0 �Packaging Information�.� Updated Section �Product Identification System�, with Automotive Qualified devices.� Minor text and format changes throughout.Reason for Change: To Improve Productivity
Revision History:October 12, 2020: Issued initial notification.February 13, 2021: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on February 28, 2021.Description of Change:Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly site.Pre Change:Using 3280 die attach materialPost Change:Using QMI-519 die attach materialPre and Post Change Summary: see attachedImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve productivity by qualifying QMI-519 die attach materialChange Implementation Status:In ProgressEstimated First Ship Date:February 28, 2021 (date code: 2110)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: see attached
PCN Status: Initial notification. Description of Change: Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly sitePre Change:Using 3280 die attach materialPost Change:Using QMI-519 die attach materialImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve productivity by qualifying QMI-519 die attach materialChange Implementation Status:In ProgressEstimated Qualification Completion Date:November 2020Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Revision History:October 12, 2020: Issued initial notification.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
Microchip MCP23008T-E/SO - Technical Attributes
| Interface Circuit Type: | I2C |
| Clock Frequency-Max: | 1.7MHz |
| No of I/O Lines: | 8 |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Supply Current: | 1mA |
| Package Style: | SOIC-18 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1100 per Reel
Package Style:
SOIC-18
Mounting Method:
Surface Mount