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Manufacturer Part #
MCP23008T-E/SO
Download the CAD models for this product. Learn more about SnapMagic.
1100 per Reel
SOIC-18
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Product Category: Interface- Serial PeripheralsNotification Subject: Data Sheet - MCP23008 and MCP23S08 Data SheetDescription of Change:Revision I (February 2026)Corrected Byte and Sequential Read in Figure 1-1.Reason for Change: To improve productivity.Date Document Changes Effective: 13 Mar 2026
Description of ChangeMicrochip has released a new Datasheet for the MCP23008 and MCP23S08 Data Sheet of devices.Reason for Change: To Improve Productivity.Date Document Changes Effective: 11 Nov 2025
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.