
Manufacturer Part #
MCP23017T-E/ML
MCP23017 Series 5.5 V 1.7 MHz SMT 16-Bit I2C I/O Expander - QFN-28
Microchip MCP23017T-E/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip MCP23017T-E/ML - Technical Attributes
Interface Type: | SPI |
Clock Frequency-Max: | 1.7MHz |
No of I/O Lines: | 16 |
Supply Voltage-Nom: | 5.5V |
Package Style: | QFN-28 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
1600 per Reel
Package Style:
QFN-28
Mounting Method:
Surface Mount