NEW! Free shipping over $50 USD. Learn more
Manufacturer Part #
PM8532B-F3EI
PFX PCle Series 32 Lane 16 Port 2-Wire / GPIO / JTAG / UART GEN3 Fanout Switch
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:40 per Tray | ||||||||||
| Date Code: | |||||||||||
Microchip PM8532B-F3EI - Product Specification
Shipping Information:
ECCN:
PCN Information:
CCB 4080 Cancellation Notice: For the qualification of STAK as an additional assembly site and WINS as an additional bumping facility for selected Microsemi PM857x, PM856x, PM854x, PM853x, PM855x device families available in 650L BBGA (27x27x2.79mm) package.Description of Change:This qualification was originally performed to qualify STAK as an additional assembly site and WINS as an additional bumping facility for selected Microsemi PM857x, PM856x, PM854x, PM853x, PM855x device families available in 650L BBGA (27x27x2.79mm) package.
CCB 3779 Final Notice: Qualification of STAK as an additional assembly site and WINS as an additional bumping facility for selected Microsemi products of the 28nm TSMC wafer technology available in 650L BBGA (27x27x2.79mm) packagePCN Status: Final notification. PCN Type: Manufacturing ChangeDescription of Change: Qualification of STAK as an additional assembly site and WINS as an additional bumping facility for selected Microsemi products of the 28nm TSMC wafer technology available in 650L BBGA (27x27x2.79mm) package.Pre Change: Assembled at ATK site and bumping facility at ATT using NAU-27 underfill material.Post Change:Assembled at ATK site and bumping facility at ATT using NAU-27 underfill material or assembled at STAK site and bumping facility at WINS using UF8830S underfill material.Reason for Change:To improve on time delivery performance by qualifying STAK as an additional assembly site and WINS as an additional bumping facility.Change Implementation Status:In Progress Estimated First Ship Date:November 02, 2019 (date code: 1944)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:May 3, 2019: Issued initial notification.October 02, 2019: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on November 02, 2019.February 28, 2020: Re-issued final notification to update the post change to correct the bumping facility from STAK to WINS.March 05, 2020: Re-issued final notification to correct the typo error of bumping facility site from STAK to WINS in qualification report.Description of Change:Qualification of STAK as an additional assembly site and WINS as an additional bumping facility for selected Microsemi products of the 28nm TSMC wafer technology available in 650L BBGA (27x27x2.79mm) package.Pre Change:Assembled at ATK site and bumping facility at ATT using NAU-27 underfill material.Post Change:Assembled at ATK site and bumping facility at ATT using NAU-27 underfill material or assembled at STAK site and bumping facility at WINS using UF8830S underfill material.Reason for Change:To improve on time delivery performance by qualifying STAK as an additional assembly site and WINS as an additional bumping facility.Estimated First Ship Date:November 02, 2019 (date code: 1944)
CCB 4080 Initial Notice: Qualification of STAK as an additional assembly site and WINS as an additional bumping facility for selected Microsemi PM857x, PM856x, PM854x, PM853x and PM855x device families available in 650L BBGA (27x27x2.79mm) package. PCN Status: Initial notification.PCN Type: Manufacturing ChangeDescription of Change: Qualification of STAK as an additional assembly site and WINS as an additional bumping facility for selected Microsemi PM857x, PM856x, PM854x, PM853x and PM855x device families available in 650L BBGA (27x27x2.79mm) package.Pre Change: Assembled at ATK site and bumping facility at ATT using NAU-27 underfill material.Post Change: Assembled at ATK site and bumping facility at ATT using NAU-27 underfill material or assembled at STAK site and bumping facility at WINS using UF8830S underfill material.
Part Status:
Available Packaging
Package Qty:
40 per Tray