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KSZ8081MNXCA-TR
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1000 per Reel
QFN-32
Surface Mount
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*** Update for PCN 116894 ***Revision History: February 04, 2025: Issued initial notification.October 23, 2025: Issued final notification. Updated notification subject to remove KSZ8091 device family. Updated affected parts list to remove KSZ8081MNXCA, KSZ8081MNXIA, KSZ8091MNXCA, KSZ8091RNBCA, SPNZ801174, KSZ8081RNBCA-TR, KSZ8091RNBCA-TR, KSZ8081MNXCA-TR, KSZ8091MNXCA TR, KSZ8091MNXIA-TR and KSZ8091RNBIA-TR catalog part numbers. Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table. Attached the qualification report. Provided estimated first ship date to be on November 24, 2025. October 27, 2025: Re-issued final notification to add note, "Note1: *The qualification of the new PFAS-free die attach material, QMI519, was officially released via PCN #CENO-16EGCZ399." for die attach material change. November 29, 2025: Re-issued final notification to include KSZ8081MNXCA, KSZ8081MNXIA, KSZ8091MNXCA, KSZ8091RNBCA, SPNZ801174, KSZ8081RNBCA-TR, KSZ8091RNBCA-TR, KSZ8081MNXCA-TR, KSZ8091MNXCA TR, KSZ8091MNXIA-TR and KSZ8091RNBIA-TR catalog part numbers due to updated scope. Updated notification subject and description of change to add KSZ8091 device family. Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280NP as a new die attach material for selected KSZ8091, KSZ8051 and KSZ8081 device families available in 32L VQFN (5x5x0.9mm) package at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280NP as a new die attach material.Estimated First Ship Date: 24 November 2025 (date code: 2548)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change: Qualification of a new lead frame with more Ag area on DAP surface prep for selected KSZ8051, KSZ8081and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package.Reason for Change: To improve productivity by qualifying a new lead frame design.Estimated First Ship Date: 17 September 2025 (date code: 2538)
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280NP as a new die attach material for selected KSZ8051, KSZ8081, and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280NP as a new die attach material.
Microchip has released a new Datasheet for the KSZ8081MNX/RNB 10BASE-T/100BASE-TX Physical Layer Transceiver Data Sheet of devices.Description of Change: DS000002202D (11-21-23) Features, Section 1.1, "General Description", Figure2-1, Figure2-2, Section8.0, Package Outline and Product Identification System Throughout document, updated Package Type from ?QFN? to ?VQFN?. Table2-1, "Pin Description ? KSZ8081MNX" and Table2-3, "Pin Description ? KSZ8081RNB" Updated INTRP resistor value from ?1.0 k?? to ?4.7k??. Table3-2, "RMII Signal Definition" Updated to show RMII signals. Table3-10, "Typical Current/ Power Consumption (VDDA_3.3 = 3.3V, VDDIO = 3.3V)" and Table3-11, "Typical Current/Power Consumption (VDDA_3.3 = 3.3V, VDDIO = 2.5V)" Values for ?3.3V Transceiver (VDDA_3.3)?, ?3.3V Digital I/Os (VDDIO)? and ?Total Chip Power? modified. Section3.4.2, RMII Back-toBack Mode (KSZ8081RNB Only) Added section. Table4-2, "Register Description" Updated register bit 18.6 to include both MII and RMII. Table7-7, "RMII Timing Parameters ? KSZ8081RNB (50MHz input to XI pin)" Updated table title from ?25 MHz? to ?50 MHz?. Section8.0, Package Outline Updated/added Package drawings (Drawing, Dimensions and Land Pattern).
Part Status:
On Order
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