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Manufacturer Part #
KSZ8091MNXIA-TR
10/100 PHY w/EEE & WOL, 0.11u
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Reel | ||||||||||
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Microchip KSZ8091MNXIA-TR - Product Specification
Shipping Information:
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PCN Information:
*** Update for PCN 116894 ***Revision History: February 04, 2025: Issued initial notification.October 23, 2025: Issued final notification. Updated notification subject to remove KSZ8091 device family. Updated affected parts list to remove KSZ8081MNXCA, KSZ8081MNXIA, KSZ8091MNXCA, KSZ8091RNBCA, SPNZ801174, KSZ8081RNBCA-TR, KSZ8091RNBCA-TR, KSZ8081MNXCA-TR, KSZ8091MNXCA TR, KSZ8091MNXIA-TR and KSZ8091RNBIA-TR catalog part numbers. Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table. Attached the qualification report. Provided estimated first ship date to be on November 24, 2025. October 27, 2025: Re-issued final notification to add note, "Note1: *The qualification of the new PFAS-free die attach material, QMI519, was officially released via PCN #CENO-16EGCZ399." for die attach material change. November 29, 2025: Re-issued final notification to include KSZ8081MNXCA, KSZ8081MNXIA, KSZ8091MNXCA, KSZ8091RNBCA, SPNZ801174, KSZ8081RNBCA-TR, KSZ8091RNBCA-TR, KSZ8081MNXCA-TR, KSZ8091MNXCA TR, KSZ8091MNXIA-TR and KSZ8091RNBIA-TR catalog part numbers due to updated scope. Updated notification subject and description of change to add KSZ8091 device family. Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280NP as a new die attach material for selected KSZ8091, KSZ8051 and KSZ8081 device families available in 32L VQFN (5x5x0.9mm) package at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280NP as a new die attach material.Estimated First Ship Date: 24 November 2025 (date code: 2548)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change: Qualification of a new lead frame with more Ag area on DAP surface prep for selected KSZ8051, KSZ8081and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package.Reason for Change: To improve productivity by qualifying a new lead frame design.Estimated First Ship Date: 17 September 2025 (date code: 2538)
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280NP as a new die attach material for selected KSZ8051, KSZ8081, and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280NP as a new die attach material.
Description of Change: DS00002275C (11-21-23) Features, Section 1.1, "General Description", Figure2-1, Figure2-2, Section12.0, Package Outline and Product Identification System Throughout document, updated Package Type from “QFN” to “VQFN”. Table2-1, "Signals -KSZ8091MNX" and Table2-3, "Signals - KSZ8091RNB" Updated INTRP resistor value from “1.0 kO” to “4.7 kO”. Table4-2, "MMD Registers Supported by KSZ8091MNX/ RNB" Updated register bit 18.6 to include both MII and RMII. Section12.0, Package Outline Updated/added Package drawings (Drawing, Dimensions and Land Pattern).Reason for Change: To improve Productivity
Description of Change:Qualification of a new lead frame with more Ag area on DAP surface prep for selected KSZ8081 and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying new lead frame with more Ag area on DAP surface prep.Change Implementation Status:In ProgressEstimated First Ship Date:December 30, 2022 (date code: 2253)
Description of Change:Qualification of FH-SC13/HR-5104 as new die attach material and G700LTD mold compound for selected Atmel ATA5577M1330C-UFQW and ATA5577M133DC-UFQW catalog part numbers (CPN) available in 2L XDFN (1.5x2x0.37mm) package at NSEB assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying FH-SC13/HR-5104 as new die attach material and G700LTD mold compound at NSEB assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 15, 2023 (date code: 2303)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=KSZ8091MNXIA-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--comm-products--phy/ksz8091mnxia-tr-microchip-4033696
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=KSZ8091MNXIA-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--comm-products--phy/ksz8091mnxia-tr-microchip-4033696
Available Packaging
Package Qty:
1000 per Reel