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Manufacturer Part #
MSC030SDA070B
700 V 60 A Through Hole Zero Recovery Silicon Carbide Schottky Diode - TO-247
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| Mfr. Name: | Microchip | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:1 per Bulk Package Style:TO-247-2 Mounting Method:Through Hole |
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Microchip MSC030SDA070B - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 116239 ***Revision History: September 25, 2025: Issued initial notification.November 26, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on January 23, 2026. Updated PCN title and parts list to add MSC010SDA070B, MSC010SDA120B, MSC010SDA170B, MSC015SDA120B, MSC020SDA120B, MSC030SDA070B, MSC030SDA120B, MSC030SDA170B, MSC050SDA070B, MSC050SDA120B and MSC050SDA170B catalog part numbers (CPN). Added column "Change (Yes/No)" in the pre and post change table.Description of Change: Qualification of ASEW as an additional assembly site for MSC010SDA070B, MSC010SDA070BVAO, MSC010SDA120B, MSC010SDA120BVAO, MSC010SDA170B, MSC015SDA120B, MSC015SDA120BVAO, MSC020SDA120B, MSC020SDA120BVAO, MSC030SDA070B, MSC030SDA070BVAO, MSC030SDA120B, MSC030SDA120BVAO, MSC030SDA170B, MSC050SDA070B, MSC050SDA070BVAO, MSC050SDA120B, MSC050SDA120BVAO and MSC050SDA170B catalog part numbers (CPN) available in 2L TO-247 package.Reason for Change: To improve on-time delivery and manufacturability by qualifying ASEW as an additional assembly site.Estimated First Ship Date: 23 January 2026 (date code: 2604)
Description of Change: Qualification of ASEW as an additional assembly site for MSC030SDA070B, MSC010SDA070B, MSC030SDA120B, MSC020SDA120B, MSC050SDA120B, MSC050SDA070B, MSC015SDA120B, MSC010SDA170B, MSC010SDA120B, MSC050SDA170B and MSC030SDA170B catalog part numbers (CPN) available in 2L TO-247 package.Reason for Change: To improve on-time delivery and manufacturability by qualifying ASEW as an additional assembly site.
***UPDATE OF PCN111361***Description:Implement packing material changes for selected PSDS and SIC products available on TO-220, TO-247 and TO-263 packages at FSTS final test site.Reason for Change: To improve productivity by implementing packing material changes for selected PSDS and SIC products.Estimated First Ship Date: 16 June 2025 (date code: 2525)Revision History: March 06, 2025: Issued initial notification.June 9, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 16, 2025.
Description of Change:Implement packing material changes for selected PSDS and SIC products available in SOT-227, TO-220, TO-247, TO-263 and TO-268 packages at FSTS and TEAM final test sites.Reason for Change:To improve productivity by implementing packing material changes for selected PSDS and SIC products.
***June 27, 2024: Re-issued final notification. Updated the affected parts list to include CPN MSC035SMA070BV01 based on the updated scope***Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:February 26, 2024: Issued initial notification.May 24, 2024: Issued final notification. Revised the affected parts list. Provided estimated first ship date to be on June 29, 2024.Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:September 22, 2022: Issued initial notification.May 9, 2023: Issued final notice. Attached the qualification report and included the estimated first ship date on May 30, 2023.Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as an additional fabrication site for 700V and 1200V SiC Schottky Barrier Diode (SBD) products of MSC010SDA070xx, MSC010SDA120xx, MSC015SDA120xx, MSC020SDA120xx, MSC030SDA070xx, MSC030SDA120xx,MSC030SDB070B, MSC050SDA070xx, MSC050SDA120xx, MSC2X1xxSDA070J, MSC2X1xxSDA120J, MSC2X21DC120J, MSC2X3xSDA070J, MSC2X3xSDA120J, MSC2X5xSDA070J, MSC2X5xSDA120J, MSC2X61DC120J device families available in die sales products, 2L TO-268, 2L TO-220, 2L TO-247, and 4L SOT-227 packages.Reason for Change:To improve on-time delivery performances by qualifying MSCO as an additional fab site.
Part Status:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MSC030SDA070B&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--diodes--silicon-carbide-diode-sic-diodes/msc030sda070b-microchip-3190981
Microchip MSC030SDA070B - Technical Attributes
| Technology: | SiC (Silicon Carbide) Schottky |
| Reverse Voltage-Max: | 700V |
| Capacitance: | 1200pF |
| Average Rectified Current-Max: | 60A |
| Forward Voltage: | 1.8V |
| Leakage Current: | 200µA |
| Operating Temp Range: | -55°C to +175°C |
| Product Status: | Active |
| Package Style: | TO-247-2 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
1 per Bulk
Package Style:
TO-247-2
Mounting Method:
Through Hole