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Manufacturer Part #
APT40DQ120BG
1200V, 40A, TO-247
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:30 per Tube Package Style:TO-247-2 Mounting Method:Through Hole | ||||||||||
| Date Code: | 2320 | ||||||||||
Microchip APT40DQ120BG - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Description of Change:Qualification of MCSO6 as an additional fabrication site for selected APT1xx, APT2xx, APT3xx, APT4xx, APT5xx, APT6xx and APT8xx device families available in various packages.Reason for Change:To improve productivity by qualifying MCSO6 as an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:January 16, 2023 (date code: 2303)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT40DQ120BG&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--diodes--ultrafast-rectifiers/apt40dq120bg-microchip-3116440
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT40DQ120BG&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--diodes--ultrafast-rectifiers/apt40dq120bg-microchip-3116440
Microchip APT40DQ120BG - Technical Attributes
| Average Rectified Current-Max: | 40A |
| Peak Current-Max: | 210A |
| Reverse Voltage-Max [Vrrm]: | 1200V |
| Reverse Current-Max: | 100µA |
| Forward Voltage: | 2.8V |
| Configuration: | Single |
| Forward RMS Current [If rms]: | 63A |
| Diode Capacitance-Max: | 36pF |
| Reverse Recovery Time-Max: | 350ns |
| Thermal Resistance: | 0.61°C/W |
| Operating Temp Range: | -55°C to +175°C |
| Storage Temperature Range: | -55°C to +175°C |
| Package Style: | TO-247-2 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
30 per Tube
Package Style:
TO-247-2
Mounting Method:
Through Hole