Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
BSP322PH6327XTSA1
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1000 par Reel
SOT-223 (TO-261-4, SC-73)
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Detailed change informationSubject Transfer of wafer production, wafer test and pre-assembly location to IFX Kulim, and change of wafer diameter from 150 mm to 200 mm, and implementation of new mould compound for PG-TO252 package, for P-Channel Small Signal and Power MOSFETsReason Wafer production, wafer test and pre-assembly location will be transferred according to the global Infineon production strategyDescription Wafer production and wafer test locationWafer diameterPre-assembly location Wafer LotnumberMould compound(PG-TO252)Halogen Free Flag (PG-TO252)OPN incl. SP#(PG-TO252)Production Lot code Marking on device (PG-TO252) Note: See SPCN document for detailed description of changesIntended start of delivery 2026-03-31 or earlier based on customer approval
Detailed change informationSubject: Introduction of additional plating production at Wuxi Welnew Microelectronic Co., Ltd., Wuxi, China for several productsReason/Motivation:Expansion of plating production to assure continuity of supply and enable flexible manufacturing by recovery of Welnew Wuxi Plating site for DS products (PCN 2023-034-A) DescriptionOldShanghai Welnew Microelectronic Co., Ltd., Shanghai, ChinaNewShanghai Welnew Microelectronic Co., Ltd., Shanghai, ChinaWuxi Welnew Microelectronic Co., Ltd., Wuxi, ChinaIntended start of delivery: 2026-06-20Last order date (LOD): 2026-06-20Last delivery date (LDD): 2026-12-20
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.