
Manufacturer Part #
SY58608UMG
SY58608U Series 2 GHz / 3.2 Gbps Precision, 1:2 LVDS Fanout Buffer - MLF-16
Microchip SY58608UMG - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL’ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
Microchip SY58608UMG - Technical Attributes
Temperature Range: | -40°C to +85°C |
Supply Voltage-Nom: | 2.375V to 2.625V |
Frequency-Max: | 2GHz |
Propagation Delay: | 200ps |
Supply Current: | 55mA |
Storage Temperature Range: | -65°C to +150°C |
No of Terminals: | 16 |
Package Style: | QFN-16 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
100 per Tube
Package Style:
QFN-16
Mounting Method:
Surface Mount