Manufacturer Part #
SY89295UMG
SY89295U 2.5V/3.3V 1.5 GHz Precision LVPECL Programmable Delay - MLF-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:60 per Tray Package Style:MLF-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip SY89295UMG - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
Microchip SY89295UMG - Technical Attributes
| Input Voltage-Max: | 4V |
| Temperature Range: | -40°C to +85°C |
| Supply Voltage-Nom: | 2.375V to 3.6V |
| Frequency-Max: | 1.5GHz |
| Package Style: | MLF-32 |
| Mounting Method: | Surface Mount |
Features & Applications
The SY89295UMG is a 2.5 V/3.3 V 1.5 GHz Precision LVPECL programmable delay line that delays the input signal using a digital control signal. The delay can vary from 3.2ns to 14.8ns in 10ps increments
In addition, the input signal is LVPECL, uses either a 2.5 V ±5% or 3.3 V ±10% power supply and is guaranteed over the full industrial temperature range –40°C to +85°C
Features:
- Precision LVPECL programmable delay line
- Guaranteed AC performance over temperature and voltage:
- > 1.5 GHz fMAX
- < 160ps rise/fall times
- Low-jitter design:
- < 10psPP total jitter
- < 2psRMS cycle-to-cycle jitter
- < 1psRMS random jitter
- Programmable delay range: 3.2ns to 14.8ns in 10ps increments
- Increased monotonicity over the MIC100EP195
- ±10% of LSB INL
- VBB output reference voltage
- Parallel inputs accepts LVPECL or CMOS/LVTTL
- Low voltage operation: 2.5 V ±5% and 3.3 V ±10%
- Industrial –40°C to +85°C temperature range
Applications:
- Clock de-skewing
- Timing adjustments
- Aperture centering
Available Packaging
Package Qty:
60 per Tray
Package Style:
MLF-32
Mounting Method:
Surface Mount