Manufacturer Part #
D0811PM2FDGUKW-U
D0811PM2x Series 8Gb (512M x 16) 1600 MHz Mobile LPDDR4 Memory IC - FBGA-200
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| Mfr. Name: | Kingston | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:144 per Tray Package Style:FBGA-200 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2346 | ||||||||||
Kingston D0811PM2FDGUKW-U - Product Specification
Shipping Information:
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PCN Information:
Change Descrip;on:Kingston?s LPDDR4/x devices based on Micron?s Z21M 8Gb die are now End of Life (EOL). Due to limited foundry support for the Micron Z21M die, future support for Z21M based devices would be discontinued.LTB :10/1/2025LTS : 1/1/2026Notes(1) All LTB orders are NCNR.(2) An increase in demand may cause the LTB date to be pulled in. Please contact your Kingston representative to forecast and to assist with replacement part sampling.(3) A mutually agreed upon forecast between Kingston and the customer for the LTB quantity is needed 3 months prior to the LTB date to secure LTB quantity.(4) LTB availability is on a first-come, first-served basis.
Part Status:
Kingston D0811PM2FDGUKW-U - Technical Attributes
| Memory Type: | SDRAM |
| Memory Density: | 8Gb |
| Configuration: | 512M x 16 |
| Supply Voltage-Nom: | 1.06V to 1.95V |
| Number of Words: | 512M |
| Word Length: | 16b |
| Access Time-Max: | 3.5ns |
| Interface Type: | LPDDR4 |
| Operating Temp Range: | -40°C to +95°C |
| Storage Temperature Range: | -55°C to +125°C |
| Package Style: | FBGA-200 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
144 per Tray
Package Style:
FBGA-200
Mounting Method:
Surface Mount