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Manufacturer Part #
24LC16B-E/SN
24LC16 Series 16 Kb I2C 2 Wire (2K X 8) 2.5 V Serial EEPROM SMT - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Product Documents for the 24AA16/24LC16B/24FC16 16K I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change: 1. Added 24FC16 and Q6B package Automotive product offerings2. Removed CSP product offering; Removed H-temp. offering from Automotive Product Identification System3. Updated DFN and SOT-23 package drawings.Impacts to Data Sheet: See above detailsReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 31 August 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Revision History:February 9, 2021: Issued final notification. Provided estimated first ship date to be February 19, 2021.March 22, 2021: Re-issued final notification. Attached the qualification report.Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame designChange Implementation Status:In ProgressEstimated First Ship Date:February 19, 2021 (date code: 2108)
Microchip has released a new Product Documents for the 24AA16/24LC16B/24FC16 Data Sheet of deviceDescription of Change: Replaced terminology Master and Slave with Host and Client respectively. Changed MUY with Q4B part number for UDFN package. Updated PDIP, SOIC, TSSOP and UDFN package drawings. Added Automotive Product Identification System. Reason for Change: To Improve Productivity Date Document Changes Effective: 17 Mar 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame design.Estimated Qualification Completion Date:March 2021
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame designEstimated First Ship Date: February 19, 2021 (date code: 2108)
Notification subject: Memo # ML01202000QB: Final Notice: Qualification of 36.3K process technology for selected Microchip products of the 24xx08 and 24xx16 device families.PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of 36.3K process technology for selected Microchip products of the 24xx08 and 24xx16device families.Pre Change: Available in 160K wafer technology fabricated at Microchip fabrication sites FAB2 and FAB4 (Tempe, AZ and Gresham, OR, USA) using 8 inch wafersPost Change: Available in 160K wafer technology fabricated at Microchip fabrication sites FAB2 and FAB4 (Tempe, AZ and Gresham, OR, USA) using 8 inch wafers or available in 36.3K wafer technology fabricated at FAB 5 (Colorado Springs, CO, USA) using 6 inch wafers.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve manufacturability by qualifying an additional fabrication site.Change Implementation Status: In ProgressEstimated First Ship Date: April 15, 2020 (date code: 2016)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts
Revision History:December 19, 2019: Issued datasheet DS20001703MJanuary 16, 2020: Re-Issued datasheet DS20001703M by narrowing the scope to affect only parts based on the device selection table.Description of Change:1) Added the 24FC16 device 2) Updated Package Drawings 3) Updated formating throughout for clarification.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 16 Jan 2020.NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Technical Attributes
| Memory Density: | 16kb |
| Memory Organization: | 2 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The 24AA16/24LC16B (24XX16*) series of 16 Kbit Electrically Erasable PROM is organized as eight blocks of 256 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7 V with standby and active currents of only 1 μA and 1 mA, respectively.
The 24XX16 also has a page write capability for up to 16 bytes of data. The 24XX16 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN and MSOP packages, and is also available in the 5-lead SOT-23 package.
Features:
- Single supply with operation down to 2.5V for 24LC16B devices
- Low-power CMOS technology
- 2-wire serial interface, I2C™ compatible
- Schmitt Trigger inputs for noise suppression
- Output slope control to eliminate ground bounce
- 100 kHz (2.5V) and 400 kHz clock compatibility
- Page write time 5 ms max.
- More than 1 million erase/write cycles
- Data retention > 200 years
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount
