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Manufacturer Part #
AT24C04C-SSHM-B
AT24C04C Series 4 Kbit (512 x 8) 1 MHz 5.5 V 1 ms 2 Wire Serial EEPROM - SOIC 8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
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Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xC, AT24C128C, AT24C16C, AT24C256C, AT24C32D and AT24C64D device families available in 8L SOIC package.Pre Change:Assembled at ANAP assembly site using palladium coated copper (PdCu) bond wire, 8290 die attach and G700A mold compound material with NiPdAu lead plating in 60 x 60 mils paddle size without lead lock.orAssembled at ASSH assembly site using palladium coated copper (PdCu) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire, EN-4900G die attach and G700LY molding compound or CEL-9240HF10AK mold compound material with NiPdAu or Matte tin lead plating in 93 x 93 mils paddle size without lead lock. and Tested at ASSH or ANAP Final Test site. Post Change: Assembled at ANAP assembly site using palladium coated copper (PdCu) bond wire, 8290 die attach and G700A mold compound material with NiPdAu lead plating in 60 x 60 mils paddle size without lead lockorAssembled at ASSH assembly site using palladium coated copper (PdCu) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire, EN-4900G die attach and G700LY molding compound or CEL-9240HF10AK mold compound material with NiPdAuor Matte tin lead plating in 93 x 93 mils paddle size without lead lock.orAssembled at MTAI assembly site using gold (Au) bond wire, 8390A die attach and G600V mold compound material with Matte tin lead plating in 90 x 90 mils paddle size with lead lock.andTested at ASSH, ANAP or MTAI Final Test site.Pre and Post Change Summary: see attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly and final test siteChange Implementation Status:In ProgressEstimated First Ship Date:February 15, 2021 (date code: 2108)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary:see attachedQualification Report:Please open the attachments included with this PCN labeled as PCN_#_Qual_Report.PCN_ LIAL-12WRCV778 Qual_Report Assembly site Qualification ReportPCN_ LIAL-12WRCV778_Qual_Report Final Test site Qualification ReportRevision History:January 19, 2021: Issued final notification. Attached the qualification report. Provided estimated first shipdate to be on February 15, 2021.
Data Sheet - AT24C04C/AT24C08C - Complete Datasheet Microchip has released a new DeviceDoc for the AT24C04C/AT24C08C - Complete Datasheet of devices.Notification Status: FinalDescription of Change: 1) Updated to the Microchip template. Microchip DS20006127 replaces Atmel document 8787.2) Updated Part Marking Information.3) Corrected tLOW typo from 400 ns to 500 ns. Corrected tAA typo from 550 ns to 450 ns.4) Updated Part Marking Information.5) Updated the "Software Reset" section. 6) Added ESD rating.7) Removed lead finish designation.8) Updated trace code format in package markings. 9) Added a figure for “System Configuration Using Two?Wire Serial EEPROMs”. 10) Updated "Block Diagram" figure.11) Added POR recommendations section.12) Updated section content throughout for clarification.13) Updated the 8U3?1 VFBGA package drawing. Updated the PDIP, SOIC, TSSOP, SOT23 and UDFN 14) package drawings to Microchip format.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 7 Dec 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
CCB 2953 Final Notice: Qualification of matte tin lead finish for selected Atmel products available PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of matte tin lead finish for selected Atmel products available in 8L SOIC at ASSH Assembly site.Pre Change: Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compound material and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material, G700 molding compound material and NiPdAu lead finish.Post Change: Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compound material and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material, CEL-9240HF10AK molding compound material and Matte Tin lead finish.Reason for Change: To improve manufacturability by qualifying new bill of material for ASSH assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: May 27, 2018 (date code: 1821)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Technical Attributes
| Memory Density: | 4kb |
| Memory Organization: | 512 x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount