Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
AT28C010-12JU
AT28C010 Series 1 Mb (128 K x 8) 5.5 V 120 ns Paged Parallel EEPROM - PLCC-32
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:32 per Tube Package Style:PLCC-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2324 | ||||||||||
Microchip AT28C010-12JU - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110290 ***Description of Change: For the qualification of MMT as a new final test site for selected AT28C010 and AT28LV010 device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change: Microchip has determined to perform a separate qualification of MMT as a new final test site for selected AT28C010 and AT28LV010 device families available in 32L PLCC (11.5x14x3.37mm) package which was announced in a separate PCN therefore this PCN is no longer validRevision History: January 22, 2025: Issued initial notification.September 29, 2025: Issued cancellation notification. PCN has been issued for this change under BLAS-26CZDA333.
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
*****FPCN111939 UPDATE*****Description of Change: Qualification of MMT as a new final test site for selected AT28C010, AT28C256, AT28C256EF, AT28HC256 and AT28LV010 device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change: To improve manufacturability by qualifying MMT as a new final test site.
Revision History:January 25, 2023: Issued initial notification.August 10, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 8, 2023.Description of Change:Qualification of MMT as a new assembly site for selected AT28C010x and AT28LV010 device families available in 32L PLCC (11.5x14x3.37mm) package.Pre and Post Change Summary: SEE ATTACHEDImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MMT as a new assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:September 8, 2023 (date code: 2336)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: SEE ATTACHED
Description of Change:Qualification of MMT as a new assembly site for selected AT28C010x and AT28LV010 device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve manufacturability by qualifying MMT as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:April 2023
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT28C010-12JU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--eeprom--parallel/at28c010-12ju-microchip-5054100
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT28C010-12JU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--eeprom--parallel/at28c010-12ju-microchip-5054100
Microchip AT28C010-12JU - Technical Attributes
| Memory Density: | 1Mb |
| Memory Organization: | 128 K x 8 |
| Supply Voltage-Nom: | 4.5V to 5.5V |
| Write Cycle Time-Max (tWC): | 10ms |
| Access Time-Max: | 120ns |
| Package Style: | PLCC-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
32 per Tube
Package Style:
PLCC-32
Mounting Method:
Surface Mount